JPS6127185Y2 - - Google Patents

Info

Publication number

JPS6127185Y2

JPS6127185Y2 JP1981045508U JP4550881U JPS6127185Y2 JP S6127185 Y2 JPS6127185 Y2 JP S6127185Y2 JP 1981045508 U JP1981045508 U JP 1981045508U JP 4550881 U JP4550881 U JP 4550881U JP S6127185 Y2 JPS6127185 Y2 JP S6127185Y2

Authority

JP

Japan

Prior art keywords

connector

transistor

mounting

heat dissipation

bushing

Prior art date

1981-03-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 230000017525 heat dissipation Effects 0.000 claims description 12
• 239000002184 metal Substances 0.000 claims description 11
• 239000011810 insulating material Substances 0.000 claims description 3
• 230000001105 regulatory effect Effects 0.000 claims 1
• 239000000758 substrate Substances 0.000 description 4
• 230000006870 function Effects 0.000 description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
• 230000004048 modification Effects 0.000 description 3
• 238000012986 modification Methods 0.000 description 3
• 238000005452 bending Methods 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229920002492 poly(sulfone) Polymers 0.000 description 1
• 230000009993 protective function Effects 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1