JPS6127162Y2 - - Google Patents
Info
- Publication number
- JPS6127162Y2 JPS6127162Y2 JP8572978U JP8572978U JPS6127162Y2 JP S6127162 Y2 JPS6127162 Y2 JP S6127162Y2 JP 8572978 U JP8572978 U JP 8572978U JP 8572978 U JP8572978 U JP 8572978U JP S6127162 Y2 JPS6127162 Y2 JP S6127162Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal cap
- layer
- solder
- capacitor
- outer diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 66
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 239000010410 layer Substances 0.000 description 54
- 239000003990 capacitor Substances 0.000 description 30
- 239000003985 ceramic capacitor Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 2
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8572978U JPS6127162Y2 (th) | 1978-06-22 | 1978-06-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8572978U JPS6127162Y2 (th) | 1978-06-22 | 1978-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS552158U JPS552158U (th) | 1980-01-09 |
JPS6127162Y2 true JPS6127162Y2 (th) | 1986-08-13 |
Family
ID=29009642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8572978U Expired JPS6127162Y2 (th) | 1978-06-22 | 1978-06-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6127162Y2 (th) |
-
1978
- 1978-06-22 JP JP8572978U patent/JPS6127162Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS552158U (th) | 1980-01-09 |
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