JPS61268415A - 樹脂成形体の製造方法 - Google Patents
樹脂成形体の製造方法Info
- Publication number
- JPS61268415A JPS61268415A JP11094485A JP11094485A JPS61268415A JP S61268415 A JPS61268415 A JP S61268415A JP 11094485 A JP11094485 A JP 11094485A JP 11094485 A JP11094485 A JP 11094485A JP S61268415 A JPS61268415 A JP S61268415A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- card
- substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 12
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical class ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 8
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 2
- 101150049492 DVR gene Proteins 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094485A JPS61268415A (ja) | 1985-05-23 | 1985-05-23 | 樹脂成形体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094485A JPS61268415A (ja) | 1985-05-23 | 1985-05-23 | 樹脂成形体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61268415A true JPS61268415A (ja) | 1986-11-27 |
| JPH0559807B2 JPH0559807B2 (enrdf_load_html_response) | 1993-09-01 |
Family
ID=14548508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11094485A Granted JPS61268415A (ja) | 1985-05-23 | 1985-05-23 | 樹脂成形体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61268415A (enrdf_load_html_response) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141014U (enrdf_load_html_response) * | 1988-03-24 | 1989-09-27 | ||
| JPH0329311U (enrdf_load_html_response) * | 1989-04-18 | 1991-03-22 | ||
| WO2003069012A1 (en) * | 2002-02-14 | 2003-08-21 | National Institute Of Water & Atmospheric Research Limited | Method and apparatus for the manufacture of a tag |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| EP2386401A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof |
| EP2386400A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
| US8773314B2 (en) | 2010-02-25 | 2014-07-08 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, case of electronic device and mould for manufacturing the same |
| US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
-
1985
- 1985-05-23 JP JP11094485A patent/JPS61268415A/ja active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141014U (enrdf_load_html_response) * | 1988-03-24 | 1989-09-27 | ||
| JPH0329311U (enrdf_load_html_response) * | 1989-04-18 | 1991-03-22 | ||
| WO2003069012A1 (en) * | 2002-02-14 | 2003-08-21 | National Institute Of Water & Atmospheric Research Limited | Method and apparatus for the manufacture of a tag |
| AU2003206473B2 (en) * | 2002-02-14 | 2008-08-28 | Ensid Investments Ltd | Method and apparatus for the manufacture of a tag |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US8773314B2 (en) | 2010-02-25 | 2014-07-08 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, case of electronic device and mould for manufacturing the same |
| EP2386401A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof |
| EP2386400A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
| US8711041B2 (en) | 2010-05-11 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same |
| US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
| US9266266B2 (en) | 2010-05-11 | 2016-02-23 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0559807B2 (enrdf_load_html_response) | 1993-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |