JPS61267315A - プラズマcvd装置 - Google Patents
プラズマcvd装置Info
- Publication number
- JPS61267315A JPS61267315A JP10978385A JP10978385A JPS61267315A JP S61267315 A JPS61267315 A JP S61267315A JP 10978385 A JP10978385 A JP 10978385A JP 10978385 A JP10978385 A JP 10978385A JP S61267315 A JPS61267315 A JP S61267315A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- glow discharge
- region
- density plasma
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978385A JPS61267315A (ja) | 1985-05-22 | 1985-05-22 | プラズマcvd装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978385A JPS61267315A (ja) | 1985-05-22 | 1985-05-22 | プラズマcvd装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61267315A true JPS61267315A (ja) | 1986-11-26 |
| JPH0578933B2 JPH0578933B2 (enrdf_load_stackoverflow) | 1993-10-29 |
Family
ID=14519107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10978385A Granted JPS61267315A (ja) | 1985-05-22 | 1985-05-22 | プラズマcvd装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61267315A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0199213A (ja) * | 1987-10-13 | 1989-04-18 | Mitsui Toatsu Chem Inc | 膜形成装置 |
| JPH01226147A (ja) * | 1988-03-07 | 1989-09-08 | Mitsui Toatsu Chem Inc | 成膜装置および成膜方法 |
| JPH07312364A (ja) * | 1995-06-08 | 1995-11-28 | Toshiba Corp | 半導体製造装置及びその製造方法 |
| US5773100A (en) * | 1987-08-14 | 1998-06-30 | Applied Materials, Inc | PECVD of silicon nitride films |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225517A (ja) * | 1983-06-06 | 1984-12-18 | Nippon Denso Co Ltd | 非晶室半導体の製造方法 |
-
1985
- 1985-05-22 JP JP10978385A patent/JPS61267315A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225517A (ja) * | 1983-06-06 | 1984-12-18 | Nippon Denso Co Ltd | 非晶室半導体の製造方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5773100A (en) * | 1987-08-14 | 1998-06-30 | Applied Materials, Inc | PECVD of silicon nitride films |
| US6040022A (en) * | 1987-08-14 | 2000-03-21 | Applied Materials, Inc. | PECVD of compounds of silicon from silane and nitrogen |
| JPH0199213A (ja) * | 1987-10-13 | 1989-04-18 | Mitsui Toatsu Chem Inc | 膜形成装置 |
| JPH01226147A (ja) * | 1988-03-07 | 1989-09-08 | Mitsui Toatsu Chem Inc | 成膜装置および成膜方法 |
| JPH07312364A (ja) * | 1995-06-08 | 1995-11-28 | Toshiba Corp | 半導体製造装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0578933B2 (enrdf_load_stackoverflow) | 1993-10-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |