JPS6126156U - Bonding strength measuring device - Google Patents
Bonding strength measuring deviceInfo
- Publication number
- JPS6126156U JPS6126156U JP11052484U JP11052484U JPS6126156U JP S6126156 U JPS6126156 U JP S6126156U JP 11052484 U JP11052484 U JP 11052484U JP 11052484 U JP11052484 U JP 11052484U JP S6126156 U JPS6126156 U JP S6126156U
- Authority
- JP
- Japan
- Prior art keywords
- bonding strength
- measuring device
- protrusion
- probe
- strength measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例の構成図、第2図は第1図に
おける要部の拡大模式図、第3図はプローブあ拡大斜視
図、第4図は第3図のプローブの変形例の斜視区、第5
図および第6図はそれぞれ剥離現象説明用の第1説明図
および第2説明図、第7図はシリコン・ウエハーの平面
図、第8図は第7図における半導体装置チップの拡大平
面図、第9図は第8図における要部の断面拡大図、第1
0図および第11図はそれそれ従来の第1および第2接
合強度測定装置の各説明図である。
2,4・・・・・・基板、3・・・・・・突起物として
の電極、一5・・・・・・突起物、11・・・一・・試
料、12・・・・・=取り付け台、15・・・・・・試
料固定機構、・16・・・・・・荷重計、17・・・・
・・プローブ、18・・・・・・測定部、26・・・・
・・駆動機構、28−・・・・・・接合強度測定装置。Fig. 1 is a configuration diagram of an embodiment of the present invention, Fig. 2 is an enlarged schematic diagram of the main parts in Fig. 1, Fig. 3 is an enlarged perspective view of the probe, and Fig. 4 is a modification of the probe shown in Fig. 3. Example strabismus area, 5th
7 and 6 are a first explanatory diagram and a second explanatory diagram for explaining the peeling phenomenon, respectively, FIG. 7 is a plan view of a silicon wafer, and FIG. 8 is an enlarged plan view of a semiconductor device chip in FIG. Figure 9 is an enlarged cross-sectional view of the main parts in Figure 8,
0 and 11 are explanatory diagrams of conventional first and second bonding strength measuring devices, respectively. 2, 4...Substrate, 3...Electrode as a protrusion, 15...Protrusion, 11...1...Sample, 12... = Mounting stand, 15... Sample fixing mechanism, 16... Load cell, 17...
...Probe, 18...Measurement part, 26...
... Drive mechanism, 28-... Joint strength measuring device.
Claims (2)
からなる試料を取り付け台と;前記試料を前記取り付け
台に固定する試料固定機構と;棒状プローブの一端に測
定部が設けられ、前記プa−ブの他端に加えられる力の
大きさを前記測定部によって測定する荷重計と;前記プ
ローブの前記他端が前記突起物を該突起物の側面から押
圧するように、前記試料固定機構によって煎記試料を固
定した前記取り付け台と、前記荷量計と、を相対的に移
動させる駆動機構と;を備え、前記測定部の測定結果に
もとづいて前記突起物の接合強度を測定することを特徴
とする接合強度測定装置。(1) a substrate; a protrusion bonded to one surface of the substrate;
a sample fixing mechanism for fixing the sample to the mounting base; and a measuring section provided at one end of the rod-shaped probe to measure the magnitude of the force applied to the other end of the probe. a load meter for measuring with a measuring section; the mounting base on which the sample is fixed by the sample fixing mechanism so that the other end of the probe presses the protrusion from the side of the protrusion; and the load and a drive mechanism for relatively moving the bonding strength measuring device, the bonding strength measuring device being characterized in that the bonding strength measuring device is characterized in that the bonding strength of the protrusion is measured based on the measurement result of the measuring section.
において、荷重計の測定部はプローブの他端に加えられ
た力の最大値を記憶、保持するように形成されているこ
とを特徴とする接合強度測定装置。(2) Utility Model Registration Scope of Claims In the measuring device according to claim 1, the measuring section of the load cell is formed to memorize and hold the maximum value of the force applied to the other end of the probe. Characteristic bonding strength measuring device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11052484U JPS6126156U (en) | 1984-07-20 | 1984-07-20 | Bonding strength measuring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11052484U JPS6126156U (en) | 1984-07-20 | 1984-07-20 | Bonding strength measuring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6126156U true JPS6126156U (en) | 1986-02-17 |
JPH0240524Y2 JPH0240524Y2 (en) | 1990-10-29 |
Family
ID=30669651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11052484U Granted JPS6126156U (en) | 1984-07-20 | 1984-07-20 | Bonding strength measuring device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6126156U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009543034A (en) * | 2006-07-03 | 2009-12-03 | デイジ プレシジョン インダストリーズ リミテッド | Tensile test apparatus and deposit testing method on electronic substrate |
JP2013096852A (en) * | 2011-11-01 | 2013-05-20 | Lintec Corp | Adhesive strength measuring apparatus and adhesive strength measuring method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226892A (en) * | 1975-08-25 | 1977-02-28 | Hitachi Ltd | Strength measuring device |
JPS55146942A (en) * | 1979-05-03 | 1980-11-15 | Mitsubishi Electric Corp | Testing method for semiconductor device |
JPS5810052U (en) * | 1981-07-15 | 1983-01-22 | 株式会社倉田電子 | Contact peel tester |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5810052B2 (en) * | 1980-11-04 | 1983-02-24 | 日本水産株式会社 | Sheet food manufacturing equipment |
-
1984
- 1984-07-20 JP JP11052484U patent/JPS6126156U/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226892A (en) * | 1975-08-25 | 1977-02-28 | Hitachi Ltd | Strength measuring device |
JPS55146942A (en) * | 1979-05-03 | 1980-11-15 | Mitsubishi Electric Corp | Testing method for semiconductor device |
JPS5810052U (en) * | 1981-07-15 | 1983-01-22 | 株式会社倉田電子 | Contact peel tester |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009543034A (en) * | 2006-07-03 | 2009-12-03 | デイジ プレシジョン インダストリーズ リミテッド | Tensile test apparatus and deposit testing method on electronic substrate |
JP2013096852A (en) * | 2011-11-01 | 2013-05-20 | Lintec Corp | Adhesive strength measuring apparatus and adhesive strength measuring method |
Also Published As
Publication number | Publication date |
---|---|
JPH0240524Y2 (en) | 1990-10-29 |
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