JPS6248036A - Characteristic measuring jig of beam lead semiconductor wafer - Google Patents

Abstract

PURPOSE:To readily detect the presence or absence of a beam lead wafer by an edge sensor by partly increasing the thickness of a jig body of a portion for bonding the wafer larger than the periphery. CONSTITUTION:A portion 1a for bonding a jig body 1 wafer made of a quartz plate is raised to be thicker than the periphery to effectively operate an edge sensor 4 for detecting the presence or absence of a beam lead semiconductor wafer 3 even if the wafer 3 is polished so that the thickness of the wafer is thin like 100-150mum. The bonding portion 1a of the wafer is formed thicker than the periphery, and since the wafer 3 is set on the portion, the sensor 4 does not detect the presence of the wafer except the portion 1a.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a quartz plate jig to which a wafer is attached when measuring characteristics of a beam-lead type semiconductor wafer.

[Conventional technology]

As shown in Fig. 4, the conventional general beam-lead semiconductor wafer characteristic measurement jig has a jig body 1 made of a quartz plate with a uniform thickness and a wax 2 for pasting.
A beam lead type semiconductor wafer 3 is pasted through the wafer.

[Problem that the invention seeks to solve]

When measuring the characteristics with an automatic measuring machine using the conventional beam lead type semiconductor wafer characteristic measurement jig mentioned above,
As shown in Figs. 5 and 6, the characteristics of each chip in the wafer are automatically measured while detecting the presence or absence of a wafer using the elastomer sensor 4 provided in the probe card. In the case of type semiconductor wafers, the sum of the wax used for wafer attachment and the wafer thickness is as thin as about 100 to 150 μm, so in the case of a normal edge sensor 4, the edge sensor itself must be operated with an overdrive amount of 200 to 300 μm. Therefore, it is detected that wafer is present even in an area where no wafer is attached, which has the disadvantage that measuring time is wasted when measuring the entire area of the jig body 1. .

The present invention provides a jig that can easily detect the presence or absence of a wafer using an edge sensor.

[Failure to solve the problem]

The jig for measuring the characteristics of a beam-lead type semiconductor wafer according to the present invention is characterized in that the thickness of the jig body is partially thicker at the portion where the beam-lead type wafer is pasted than at the surrounding area.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, 1 is a jig body made of a quartz plate, 2 is wax, 3 is a beam/IJ-type semiconductor wafer, and 4 is a jig body made of a quartz plate.
is the edge sensor of the probe card. In FIG. 1, the present invention has a structure in which a portion 1a of a jig main body 1 made of a quartz plate to which a wafer is pasted is raised to make it thicker than the surrounding area, thereby creating a beam lead type semiconductor wafer-3. Even when the wafer is polished to a thickness of 100 to 150 microns, the edge sensor 4 for detecting the presence or absence of the wafer can operate reliably.

In the example, as shown in FIGS. 2 and 3, the thickness of the wafer is thicker in the part 1a than the surrounding area, and Ueno-3 is set in that part, so the wafer can be pasted. The edge sensor 4 does not detect the presence of a wafer in areas other than the portion 1a.

〔Effect of the invention〕

As explained above, in the present invention, by partially increasing the thickness of the jig main body at the part where the beam-lead semiconductor wafer is attached, polishing the jig to a thinner thickness of about 100 to 150 μm is possible, just like the beam-lead semiconductor wafer. Even if the probe curve card is processed, the operation of the edge sensor provided in the probe curve card becomes reliable, which makes it easier to detect the presence or absence of a wafer, and makes it possible to efficiently measure characteristics using an automatic measuring machine.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing a jig for measuring characteristics of a beam-lead type semiconductor wafer according to the present invention, and Fig. 2 shows a state in which an edge sensor detects a wafer set in the jig according to the present invention. The cross-sectional view shown in Figure 3 shows the edge sensor correctly detecting the wafer h on the jig where no wafer is set.
Figure 4 is a cross-sectional view showing a conventional beam lead type semiconductor wafer characteristic measurement jig, Figure 5 is an edge sensor detecting the wafer. FIG. 6 is a cross-sectional view showing that the edge sensor does not correctly detect the presence or absence of a wafer even on a quartz plate without a wafer. 1... Jig main body made of quartz plate, 2... Wax for wafer attachment, 3... Beam lead type semiconductor wafer, 4... Edge sensor.

Claims (1)

[Claims] (1) A jig used to measure the characteristics of a beam-lead semiconductor wafer, characterized in that the thickness of the jig body at the part where the beam-lead semiconductor wafer is pasted is thicker than the surrounding area. A jig for measuring wafer characteristics.