JPH0361338U - - Google Patents
Info
- Publication number
- JPH0361338U JPH0361338U JP12186189U JP12186189U JPH0361338U JP H0361338 U JPH0361338 U JP H0361338U JP 12186189 U JP12186189 U JP 12186189U JP 12186189 U JP12186189 U JP 12186189U JP H0361338 U JPH0361338 U JP H0361338U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit
- bonding pad
- signal
- test circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案による集積回路装置の一実施例
を示す半導体チツプの部分平面図、第２図は従来
の集積回路装置の一例を示す半導体チツプの部分
平面図である。
１，２，３，４……信号配線、５……電源線、
６，７，８，１４……ボンデイングパツド、９…
…プロービングパツド、１０，１１，１２，１３
……プローブ、１５……半導体基板。
FIG. 1 is a partial plan view of a semiconductor chip showing an embodiment of an integrated circuit device according to the present invention, and FIG. 2 is a partial plan view of a semiconductor chip showing an example of a conventional integrated circuit device. 1, 2, 3, 4...signal wiring, 5...power line,
6, 7, 8, 14... bonding pad, 9...
...probing pad, 10, 11, 12, 13
...Probe, 15...Semiconductor substrate.
Claims (1)
るボンデイングパツドと、回路機能を検査する試
験回路と、この試験回路に信号を印加するボンデ
イングパツドとを有する集積回路装置において、
前記試験回路に信号を印加する前記ボンデイング
パツドを削除して、代りに前記試験回路と接続す
る信号配線上にプロービングパツドを設けたこと
を特徴とする集積回路装置。 An integrated circuit device having an integrated circuit, a bonding pad for transferring signals to and from the integrated circuit, a test circuit for testing circuit function, and a bonding pad for applying a signal to the test circuit,
An integrated circuit device characterized in that the bonding pad for applying a signal to the test circuit is removed and a probing pad is provided on the signal wiring connected to the test circuit instead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12186189U JPH0361338U (en) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12186189U JPH0361338U (en) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361338U true JPH0361338U (en) | 1991-06-17 |
Family
ID=31669883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12186189U Pending JPH0361338U (en) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361338U (en) |
-
1989
- 1989-10-17 JP JP12186189U patent/JPH0361338U/ja active Pending
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