JPH02131674U - - Google Patents

Info

Publication number
JPH02131674U
JPH02131674U JP4082189U JP4082189U JPH02131674U JP H02131674 U JPH02131674 U JP H02131674U JP 4082189 U JP4082189 U JP 4082189U JP 4082189 U JP4082189 U JP 4082189U JP H02131674 U JPH02131674 U JP H02131674U
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
measuring
socket
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4082189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4082189U priority Critical patent/JPH02131674U/ja
Publication of JPH02131674U publication Critical patent/JPH02131674U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bはそれぞれ本考案の一実施例の斜
視図及び第1図aのA−A′線断面図、第2図a
,bはそれぞれ本考案の他の実施例の斜視図及び
第2図aのA−A′線断面図である。 1,1′……DUTボード基板、2,2′……
ICソケツト、3,3′……半導体装置接触ピン
、4……温度感知機、5,5′……半導体装置、
6……温度感知機配線、7……半導体装置の測定
用装置。
Figures 1a and b are a perspective view of an embodiment of the present invention, a sectional view taken along line A-A' in Figure 1a, and Figure 2a.
, b are a perspective view of another embodiment of the present invention and a sectional view taken along the line A-A' in FIG. 2a, respectively. 1, 1'...DUT board substrate, 2, 2'...
IC socket, 3, 3'... semiconductor device contact pin, 4... temperature sensor, 5, 5'... semiconductor device,
6... Temperature sensor wiring, 7... Device for measuring semiconductor devices.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上にICソケツトが固定された半導体装置
の測定用基板において、前記半導体装置と相対向
する前記ICソケツト面に温度感知機を備えたこ
とを特徴とする半導体装置の測定用基板。
What is claimed is: 1. A substrate for measuring a semiconductor device, the substrate for measuring a semiconductor device having an IC socket fixed on the substrate, further comprising a temperature sensor on a surface of the IC socket facing the semiconductor device.
JP4082189U 1989-04-05 1989-04-05 Pending JPH02131674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4082189U JPH02131674U (en) 1989-04-05 1989-04-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4082189U JPH02131674U (en) 1989-04-05 1989-04-05

Publications (1)

Publication Number Publication Date
JPH02131674U true JPH02131674U (en) 1990-11-01

Family

ID=31550943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4082189U Pending JPH02131674U (en) 1989-04-05 1989-04-05

Country Status (1)

Country Link
JP (1) JPH02131674U (en)

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