JPH0428442U - - Google Patents
Info
- Publication number
- JPH0428442U JPH0428442U JP6869890U JP6869890U JPH0428442U JP H0428442 U JPH0428442 U JP H0428442U JP 6869890 U JP6869890 U JP 6869890U JP 6869890 U JP6869890 U JP 6869890U JP H0428442 U JPH0428442 U JP H0428442U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- support substrate
- probes
- wiring
- insulating ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の構造説明図、第２図は本考案
の一実施例を説明する断面図、第３図は本考案の
同時測定型の実施例を説明する平面図、第４図は
従来例のプローブカードの平面図、第５図ａ〜ｄ
は従来例のプローブカードの断面図である。
図において、１はプローブ、２は支持基板、２
Ｒは支持基板の内周に設けられた絶縁リング、２
Ｅはプローブを固定するエポキシ樹脂層、２Ｂは
プローブを固定するブレード、２Ｗはプリント配
線、３はチツプ、４はパツド、である。
Fig. 1 is a structural diagram of the present invention, Fig. 2 is a sectional view illustrating an embodiment of the present invention, Fig. 3 is a plan view illustrating a simultaneous measurement type embodiment of the present invention, and Fig. 4 is a diagram illustrating the structure of the present invention. Plan view of conventional probe card, Figures 5a-d
is a sectional view of a conventional probe card. In the figure, 1 is a probe, 2 is a support substrate, 2
R is an insulating ring provided on the inner periphery of the support substrate, 2
E is an epoxy resin layer for fixing the probe, 2B is a blade for fixing the probe, 2W is a printed wiring, 3 is a chip, and 4 is a pad.
Claims (1)
しようとするパツドに接触できるように先端が自
由端となり、 該支持基板２は中空部を有し、両面に該プロー
ブ１及び測定器に接続する配線２Ｗと、該中空部
内周に絶縁リング２Ｒが設けられ、 該絶縁リング２Ｒは上部および下部に内側下方
向に向かつて傾斜する斜面を有し、該両斜面にそ
れぞれ該プローブ１が固定され、該プローブはそ
れぞれ該支持基板２の表面および裏面の該配線２
Ｗに接続されていることを特徴とするウエハ試験
用プローブカード。[Claims for Utility Model Registration] It has a probe 1 and a support substrate 2, the probe 1 is supported by the support substrate 2, the tip thereof is a free end so that it can contact the pad to be measured, and the support The substrate 2 has a hollow part, and wiring 2W connecting to the probe 1 and the measuring device is provided on both sides, and an insulating ring 2R is provided on the inner periphery of the hollow part, and the insulating ring 2R is provided at the upper and lower parts facing inwardly and downwardly. The probes 1 are fixed to both slopes, and the probes are connected to the wiring 2 on the front and back surfaces of the support substrate 2, respectively.
A probe card for wafer testing characterized by being connected to W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6869890U JPH0428442U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6869890U JPH0428442U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428442U true JPH0428442U (en) | 1992-03-06 |
Family
ID=31603357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6869890U Pending JPH0428442U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008093465A1 (en) * | 2007-01-29 | 2008-08-07 | Advantest Corporation | Testing apparatus and probe card |
-
1990
- 1990-06-28 JP JP6869890U patent/JPH0428442U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008093465A1 (en) * | 2007-01-29 | 2008-08-07 | Advantest Corporation | Testing apparatus and probe card |
| US7960991B2 (en) | 2007-01-29 | 2011-06-14 | Advantest Corporation | Test apparatus and probe card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0428442U (en) | ||
| JPH0323368U (en) | ||
| JPS62170543U (en) | ||
| JPS5868036U (en) | Semiconductor integrated circuit measurement equipment | |
| JPS60183442U (en) | Integrated circuit measurement jig | |
| JPS6336042U (en) | ||
| JPH0361338U (en) | ||
| JPS6457644U (en) | ||
| JPS58148933U (en) | integrated circuit measurement equipment | |
| JPH0390081U (en) | ||
| JPH01180675U (en) | ||
| JPH01174932U (en) | ||
| JPS63276U (en) | ||
| JPH0380373U (en) | ||
| JPS5915907U (en) | Multiple measuring point exchange device for three-dimensional measuring instruments | |
| JPS63180931U (en) | ||
| JPS62134244U (en) | ||
| JPH0430734U (en) | ||
| JPS63178326U (en) | ||
| JPS61136542U (en) | ||
| JPH0363935U (en) | ||
| JPH0470746U (en) | ||
| JPS6393576U (en) | ||
| JPS645174U (en) | ||
| JPS61207031U (en) |