JPH0240524Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a fine pattern of a layered structure such as an electrode of a semiconductor device formed to protrude on a silicon substrate, between a pattern and a substrate, or between layers. The present invention relates to a measuring device for measuring the bonding strength of a metal, particularly to a configuration that facilitates measurement operations.

[Prior art and its problems]

In a semiconductor device, for example, when forming an electrode, a pattern with a layered structure is sometimes formed so as to protrude on a silicon substrate, and in this case, the bonding strength between the pattern and the silicon substrate or between each layer forming the pattern is Since this is an important requirement that affects the lifespan, performance, etc. of a semiconductor device, it is necessary to measure the bonding strength in the manufacturing process of a semiconductor device. Figure 7 is a plan view of a silicon wafer, and the section marked 1 in the figure is a silicon wafer.
A semiconductor device chip having an electric circuit pattern formed on a wafer, FIG. 8 is an enlarged plan view of one semiconductor device chip 1, and FIG. 9 is a partially enlarged view of a section taken along line GG in FIG. In FIGS. 8 and 9, reference numeral 2 indicates a silicon substrate, and reference numeral 3 indicates an electrode as a protrusion of a multi-layered structure stacked on the silicon substrate 2 so as to protrude. In FIG. 8, the electrodes 3 are arranged in rows, one above the other, and each electrode has a rectangular planar shape, and A and B indicate the dimensions of the strip. In FIG. 8, electric circuit patterns other than the electrode 3 are not shown for convenience of explanation. H and D in FIG. 9 are the height and center-to-center distance of the electrodes 3, respectively;
For example, A=80μm, B=150μm, H=20μm,
It has dimensions such as D=100 μm. In the semiconductor device chip 1, the electrode 3 is formed as described above, and in order to ship the chip 1 with high reliability, the bonding strength of this electrode to the silicon substrate 2 and the bonding strength between each layer constituting the electrode 3 are required. needs to be measured.

Now, when measuring the bonding strength of a multilayered protrusion formed on a substrate by bonding, such as the electrode 3 mentioned above, the method shown in FIG. 10 has been commonly adopted. . That is,
In FIG. 10, 4 is a flat substrate, 5 is a protrusion of a multilayer metal film structure stacked on the substrate 4 and formed to protrude, and 6 is bonded by bringing one end surface into contact with the upper surface of the protrusion 5. A rod-shaped member for measurement fixed by a fixing agent 7. In this case, with the substrate 4 fixed to a mounting base (not shown), P is attached at the other end of the member 6.
A force is applied in the direction of the arrow, and a detection device (not shown) detects the applied force when separation occurs between the protrusion 5 and the substrate 4 or between the layers constituting the protrusion, and the protrusion 5 and the substrate are separated. 4 and between each layer constituting the protrusion 5 (hereinafter, the bond at multiple locations may simply be referred to as the bond between the protrusion and the substrate). In the measurement method, the adhesive 7 often peels off before the bonded part peels off, making measurement impossible, and the planar shape of the protrusion 5 is changed in order to perform the bonding work with the adhesive 7. It is necessary to have a size of about 1 cm square or more, and there is a problem that it cannot be applied to a protrusion like the electrode 3 in FIG. 8.

FIG. 11 is an explanatory diagram of a conventional measuring device different from FIG. 10, and the difference from FIG. 10 is that the substrate 4
A second rod-shaped member 9 is bonded and fixed with adhesive 8 to a position on the back surface of the substrate 4 corresponding to the position on the surface where the protrusion 5 is provided, with one end surface in contact with the substrate. In this case, the joint strength is measured by applying a force to each of the members 6 and 9 in the direction of the arrow shown in the figure.
It is clear that the same problem as in the case of FIG. 10 exists in this case as well.

[Purpose of invention]

The present invention solves the above-mentioned problems in conventional bonding strength measurement, and makes it possible to reliably and easily measure the bonding strength between microscopic protrusions formed on a substrate, the protrusions and the substrate, or the layers of the protrusions. The purpose of the present invention is to provide a bonding strength measuring device that can perform the following steps.

[Key points of the idea]

In order to achieve the above-mentioned object, the present invention includes a mount for attaching a sample having protrusions formed by bonding on one surface of a substrate, a sample fixing mechanism for fixing the sample to the mount, and a mount for fixing the sample to the mount. A load cell having a measuring part provided at one end of a rod-like probe having a cone-like or wedge-like shape that contacts at an acute angle, and measuring force applied to the other end of the probe by the measuring part;
With the sample attached and fixed to the mounting base, the mounting base and the load cell are moved relatively so that the other end of the probe maintains a distance from the substrate surface of the sample and presses the side surface of the protrusion. The drive mechanism constitutes a bonding strength measurement device, and the drive mechanism applies shear force to the protrusion formed on the sample with the probe of the load cell, thereby forming a joint or a protrusion between the protrusion and the substrate. By causing peeling between the layers and measuring the shear force when this peeling occurs with the measuring section of the load cell, the bonding strength at the bonded portion can be measured. However, the bond between the protrusion and the substrate or the strength between the layers of the protrusion can be measured reliably and easily.

[Example of idea]

Fig. 1 is a block diagram of one embodiment of the present invention, Fig. 2 is an enlarged schematic diagram of the main parts in Fig. 1, and Fig. 3 is a schematic diagram of the main parts of Fig. 1.
FIG. 3 is an enlarged perspective view of the probe of the load cell in FIG. 2; In Figures 1 to 3, 1
Reference numeral 2 denotes a plate-shaped mounting base on which a sample 11 consisting of a silicon substrate 2 and an electrode 3 as a protrusion is placed with the surface on which the electrode 3 is formed facing forward; After being placed on the mounting base 12, the mounting base 1 is removed by a vacuum suction device 14 including a pump etc. via an internal mechanism (not shown) such as a through hole provided in the mounting base 12 and a pipe 13.
2 is adsorbed and fixed. Reference numeral 15 denotes a sample fixing mechanism which fixes the sample 11 to the mount 12 in this manner and is composed of the above-mentioned mount internal mechanism, the pipe 13, and the vacuum suction device 14. 16 is a load cell equipped with a rod-shaped probe 17 and a measuring part 18;
In this case, the probe 17 is a rod-like probe having a cone-like or wedge-like shape that contacts the protrusion at its acutest corner.For example, the shape is formed as shown in FIG. Although the shape is shown as being composed of a triangular pyramid-like cone portion 17b, it is also possible to have a shape consisting only of the main body portion 17a without the cone portion 17b, as shown in FIG. Here, the point of the acutest corner that comes into contact with the protrusion is the ridgeline 17c in the case of the triangular pyramidal pyramidal part 17b in FIG. 3, and the ridgeline 17d in the case of the main body part 17a in FIG. 4. The probe 17 is the main body part 17
It is connected to a measuring section 18 via a lever 19 fixed to the other end of the probe, and the measuring section 18 measures the force applied to the pyramidal part 17b of the probe by an internal mechanism such as a strain detector (not shown). It is configured to measure the size, store and hold the maximum value of the measurement result, and output it as an electrical signal. A display 20 displays the output signal of the measurement section 18 via a cable 21. Although not shown, the measuring section 18 is provided with a reset mechanism for resetting the output signal. Reference numeral 22 denotes legs that support the measurement unit 18 and are fixed to the apparatus stand 23. Display unit 20 also has legs 22
It is fixed to the equipment stand 23 by.

Reference numeral 24a denotes an X-axis block driven in the horizontal X-axis direction in the paper plane of FIG. 1 by an X-axis motor 24c fixed to an It is fixed to the X-axis block 24a so that its top surface is horizontal. The block 24a is configured to move on a support base 24b, and the block 24d is configured to move on a support base 24b.
This is a knob to manually move the . 24 is an X-axis mechanism consisting of a block 24a, a support base 24b, a motor 24c, and a knob 24d.

25a is the Y-axis motor 2 fixed to the equipment stand 23
The support base 24b is fixed to the block 25a, which is a Y-axis block driven by a Y-axis block 5c in the Y-axis direction perpendicular to the paper plane of FIG. 25 is block 25
This Y-axis mechanism consists of a and a motor 25c.
The shaft mechanism is also provided with a knob 25d for manually moving the block 25a. In FIG. 1, since the X-axis mechanism 24 and the Y-axis mechanism 25 are configured as described above, the mounting table 12, and therefore the sample 11, can be moved two-dimensionally by the motors 24c, 25c and the knobs 24d, 25d. In this case, by moving the sample 11, the conical part 17b of the probe 17 of the load cell can press the electrode 3 from the side surface of the sample 11. ing. Reference numeral 26 denotes a drive mechanism consisting of an X-axis mechanism 24 and a Y-axis mechanism 25, which moves the mounting base 12 on which the sample 11 is fixed as described above. 27 is a microscope that allows the state in which the probe 17 presses the electrode 3 to be visually observed;
is a bonding strength measuring device consisting of the above-mentioned parts.

Since the measuring device 28 is configured as described above, the ridgeline 17 of the conical portion 17b of the probe of the load cell
When the drive mechanism 26 is operated so as to press the side surface of the electrode 3 of the sample 11 fixed on the mounting base 12, approximately three types of phenomena occur depending on the bonding state between the electrode 3 and the substrate 2. An arrow Q in FIG. 2 indicates the direction of movement of the sample 11 with respect to the probe 17 at this time. That is, the first phenomenon is that the entire electrode 3 is peeled off from the substrate 2 due to the pressing force of the probe 17, as shown in FIG. 5, and the second phenomenon is as shown in FIG. Electrode 3 is probe 1
A third phenomenon is a phenomenon in which the electrode 3 is cut by the probe 17 and a part of the electrode peels off from the substrate 2.The third phenomenon is a phenomenon in which the electrode 3 is only cut by the probe 17 and no peeling occurs as described above. It is. However, in the main measurement device 28, the shape of the conical portion 17b of the probe is determined so that the above-mentioned third phenomenon does not occur, so according to such a measurement device 28,
In both of the first and second phenomena described above, the strength of the bond between the electrode 3 and the substrate 2 can be reliably measured by the display 20, and this measurement is possible even if the electrode 3 and its arrangement are minute. Even if it is, the drive mechanism 26 and the microscope 27 can easily perform this.

In the above-described embodiment, the mounting base 12 is moved relative to the stationary load cell 16 by the drive mechanism 26, but the present invention is configured such that the mounting base 12 is stationary and the load cell 16 is moved. There is no need to explain that the present invention can also be applied to measuring the bonding strength of protrusions other than the electrode 3.

[Effect of idea]

As mentioned above, in the present invention, there is provided a mounting base for attaching a sample having multilayer protrusions formed by bonding on one surface of a substrate, a sample fixing mechanism for fixing the sample to the mounting base, and a mounting base for attaching a sample having multilayer protrusions formed by bonding on one surface of a substrate, a sample fixing mechanism for fixing the sample to the mounting base, and A measuring section is provided at one end of a rod-like probe having a cone-like or wedge-like shape that makes contact with the probe, and the measuring section measures the magnitude of a force in a right angle direction that is applied to the other end of the probe by the contact. With the sample attached and fixed to the mounting base, the mounting base and the load cell are moved relative to each other so that the other end of the probe maintains the distance from the substrate surface of the sample and presses the side of the protrusion. The drive mechanism constitutes a bonding strength measurement device, and the drive mechanism applies shear force to the protrusion formed on the sample with the probe of the load cell to measure the bond between the protrusion and the substrate or the protrusion. The bonding strength at the bonded portion is measured by causing peeling at the joint between the layers and measuring the shear force when this peeling occurs using the measuring section of the load cell. However, there is an effect that the strength of the bond between the protrusion and the substrate or the bond between the layers of the protrusion can be measured reliably and easily.

In particular, in the case of a protrusion made of multiple layers, this method has a remarkable effect in that it is possible to check which layer of each layer was peeled off under what load.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram of an embodiment of the present invention, Fig. 2 is an enlarged schematic diagram of the main parts in Fig. 1, Fig. 3 is an enlarged perspective view of the probe, and Fig. 4 is a modification of the probe shown in Fig. 3. The perspective view of the example, FIGS. 5 and 6 are a first explanatory view and a second explanatory view for explaining the peeling phenomenon, respectively;
7 is a plan view of the silicon wafer, FIG. 8 is an enlarged plan view of the semiconductor device chip in FIG. 7,
Figure 9 is an enlarged cross-sectional view of the main parts in Figure 8;
FIG. 0 and FIG. 11 are explanatory views of conventional first and second bonding strength measuring devices, respectively. 2, 4... Substrate, 3... Electrode as a protrusion,
5... Protrusion, 11... Sample, 12... Mounting stand, 15... Sample fixing mechanism, 16... Load cell, 1
7...Probe, 18...Measuring unit, 26...Drive mechanism, 28...Joint strength measuring device.

Claims (1)

[Claims for Utility Model Registration] 1. A mounting base for mounting a sample, comprising a substrate and a multilayer protrusion bonded to one surface of the substrate; a sample fixing mechanism for fixing the sample to the mounting base; a rod-like probe having a cone-like or wedge-like shape that contacts the protrusion at its acutest corner;
A measuring section is provided at one end of the rod-shaped probe,
a load meter for measuring the magnitude of a force in the perpendicular direction applied to the other end of the probe due to the contact, using the measuring section; while maintaining the distance between the other end of the probe and the substrate surface of the sample; and a drive mechanism that relatively moves the mounting base to which the sample is fixed by the sample fixing mechanism and the load cell so as to press the side surface of the protrusion. Bonding strength measuring device. 2 Utility Model Registration In the measuring device according to claim 1, the measuring section of the load cell is formed to memorize and hold the maximum value of the force in the perpendicular direction applied to the other end of the probe due to the contact. A bonding strength measuring device characterized by: