JPS6125775B2 - - Google Patents
Info
- Publication number
- JPS6125775B2 JPS6125775B2 JP676579A JP676579A JPS6125775B2 JP S6125775 B2 JPS6125775 B2 JP S6125775B2 JP 676579 A JP676579 A JP 676579A JP 676579 A JP676579 A JP 676579A JP S6125775 B2 JPS6125775 B2 JP S6125775B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporation source
- substrate
- hcd
- ion plating
- gas discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008020 evaporation Effects 0.000 claims description 17
- 238000001704 evaporation Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000007733 ion plating Methods 0.000 claims description 11
- 238000009827 uniform distribution Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 15
- 238000009826 distribution Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- -1 titanium Chemical class 0.000 description 1
- NMJKIRUDPFBRHW-UHFFFAOYSA-N titanium Chemical compound [Ti].[Ti] NMJKIRUDPFBRHW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP676579A JPS55100975A (en) | 1979-01-23 | 1979-01-23 | Hcd type ion plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP676579A JPS55100975A (en) | 1979-01-23 | 1979-01-23 | Hcd type ion plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55100975A JPS55100975A (en) | 1980-08-01 |
JPS6125775B2 true JPS6125775B2 (enrdf_load_stackoverflow) | 1986-06-17 |
Family
ID=11647263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP676579A Granted JPS55100975A (en) | 1979-01-23 | 1979-01-23 | Hcd type ion plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55100975A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717064U (ja) * | 1993-09-14 | 1995-03-28 | ダイワ精工株式会社 | 魚釣用両軸受型リールのバックラッシュ防止装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5947381A (ja) * | 1982-09-10 | 1984-03-17 | Joshin Uramoto | シートプラズマを利用したイオン打込み方法 |
JP2567843B2 (ja) * | 1986-06-04 | 1996-12-25 | 株式会社 昭和真空 | ハイブリツドイオンプレ−テイング方法とその装置 |
US6946031B2 (en) | 2002-02-08 | 2005-09-20 | Fuji Photo Film Co., Ltd. | Rod for a coating device, and process for producing the same |
-
1979
- 1979-01-23 JP JP676579A patent/JPS55100975A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717064U (ja) * | 1993-09-14 | 1995-03-28 | ダイワ精工株式会社 | 魚釣用両軸受型リールのバックラッシュ防止装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS55100975A (en) | 1980-08-01 |
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