JPS61244038A - ウエハのアライメント装置 - Google Patents

ウエハのアライメント装置

Info

Publication number
JPS61244038A
JPS61244038A JP60085446A JP8544685A JPS61244038A JP S61244038 A JPS61244038 A JP S61244038A JP 60085446 A JP60085446 A JP 60085446A JP 8544685 A JP8544685 A JP 8544685A JP S61244038 A JPS61244038 A JP S61244038A
Authority
JP
Japan
Prior art keywords
wafer
alignment
optical system
stage table
upper stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60085446A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553059B2 (enExample
Inventor
Yoshiji Namiki
南木　美嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP60085446A priority Critical patent/JPS61244038A/ja
Publication of JPS61244038A publication Critical patent/JPS61244038A/ja
Publication of JPH0553059B2 publication Critical patent/JPH0553059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H10P72/50—
    • H10P72/53—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP60085446A 1985-04-23 1985-04-23 ウエハのアライメント装置 Granted JPS61244038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60085446A JPS61244038A (ja) 1985-04-23 1985-04-23 ウエハのアライメント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60085446A JPS61244038A (ja) 1985-04-23 1985-04-23 ウエハのアライメント装置

Publications (2)

Publication Number Publication Date
JPS61244038A true JPS61244038A (ja) 1986-10-30
JPH0553059B2 JPH0553059B2 (enExample) 1993-08-09

Family

ID=13859100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60085446A Granted JPS61244038A (ja) 1985-04-23 1985-04-23 ウエハのアライメント装置

Country Status (1)

Country Link
JP (1) JPS61244038A (enExample)

Also Published As

Publication number Publication date
JPH0553059B2 (enExample) 1993-08-09

Similar Documents

Publication Publication Date Title
TWI383936B (zh) 基板交換裝置、基板處理裝置及基板檢查裝置
KR100640105B1 (ko) 무인운반차, 무인운반차시스템 및 웨이퍼운반방법
JPH05226214A (ja) 基板保持装置
JP2649519B2 (ja) 平板状物体移送位置決め装置
JPS6372138A (ja) シリコンウエハ−の位置決め装置
KR102742279B1 (ko) 얼라이너 장치 및 가공부품의 위치 어긋남 보정방법
JPS61208841A (ja) 半導体ウエハの位置合せ装置
JPS6085536A (ja) ウエハ位置決め装置
JPS61244038A (ja) ウエハのアライメント装置
JPH0922933A (ja) 基板搬送方法及びその装置
JPS61244039A (ja) ウエハのアライメント装置
JPS61228643A (ja) ウエハのアライメント装置
JPH0556654B2 (enExample)
TW202230589A (zh) 對準裝置
JP3261892B2 (ja) Ｔａｂ搭載装置
JP5187231B2 (ja) プリアライナ装置、ウェハ搬送システム、半導体製造装置、半導体検査装置およびウェハのアライメント方法
JPH06163357A (ja) 露光装置
JPS61201440A (ja) ウエハのアライメント装置
JP3127627B2 (ja) 半導体ウェーハ搬送装置
JPS61228642A (ja) ウエハのアライメント装置
JPH0410452A (ja) 基板の縦型搬送装置
JPH10154743A (ja) ウェハー処理装置
JP2001093960A (ja) 処理装置用ウエファ位置決め装置
JPS61201442A (ja) ウエハのアライメント装置
JPH06329252A (ja) 基板搬送ハンドおよびこれを備えた基板搬送装置