JPS61240666A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS61240666A JPS61240666A JP8182885A JP8182885A JPS61240666A JP S61240666 A JPS61240666 A JP S61240666A JP 8182885 A JP8182885 A JP 8182885A JP 8182885 A JP8182885 A JP 8182885A JP S61240666 A JPS61240666 A JP S61240666A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thermal expansion
- metal substrate
- layers
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 229910001374 Invar Inorganic materials 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8182885A JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8182885A JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61240666A true JPS61240666A (ja) | 1986-10-25 |
| JPH0322707B2 JPH0322707B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Family
ID=13757332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8182885A Granted JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61240666A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939214A (en) * | 1989-05-31 | 1999-08-17 | Advanced Technology Interconnect, Incorporated | Thermal performance package for integrated circuit chip |
| US7362001B2 (en) | 2002-10-28 | 2008-04-22 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
| US7411324B2 (en) | 2002-10-28 | 2008-08-12 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
| US7456531B2 (en) | 2003-07-24 | 2008-11-25 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| EP2056344A4 (en) * | 2006-07-28 | 2012-12-19 | Kyocera Corp | STORAGE PACKAGING FOR ELECTRONIC COMPONENTS AND ELECTRONIC ARRANGEMENT |
-
1985
- 1985-04-17 JP JP8182885A patent/JPS61240666A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939214A (en) * | 1989-05-31 | 1999-08-17 | Advanced Technology Interconnect, Incorporated | Thermal performance package for integrated circuit chip |
| US7362001B2 (en) | 2002-10-28 | 2008-04-22 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
| US7411324B2 (en) | 2002-10-28 | 2008-08-12 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
| US7456531B2 (en) | 2003-07-24 | 2008-11-25 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| US7759831B2 (en) | 2003-07-24 | 2010-07-20 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| EP2056344A4 (en) * | 2006-07-28 | 2012-12-19 | Kyocera Corp | STORAGE PACKAGING FOR ELECTRONIC COMPONENTS AND ELECTRONIC ARRANGEMENT |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322707B2 (enrdf_load_stackoverflow) | 1991-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |