JPS61235575A - ドライエツチング装置 - Google Patents
ドライエツチング装置Info
- Publication number
- JPS61235575A JPS61235575A JP7438085A JP7438085A JPS61235575A JP S61235575 A JPS61235575 A JP S61235575A JP 7438085 A JP7438085 A JP 7438085A JP 7438085 A JP7438085 A JP 7438085A JP S61235575 A JPS61235575 A JP S61235575A
- Authority
- JP
- Japan
- Prior art keywords
- etching gas
- etching
- vacuum
- vessel
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001312 dry etching Methods 0.000 title claims description 10
- 238000005530 etching Methods 0.000 claims abstract description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052681 coesite Inorganic materials 0.000 abstract description 5
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 5
- 229910052682 stishovite Inorganic materials 0.000 abstract description 5
- 229910052905 tridymite Inorganic materials 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000498 cooling water Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7438085A JPS61235575A (ja) | 1985-04-10 | 1985-04-10 | ドライエツチング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7438085A JPS61235575A (ja) | 1985-04-10 | 1985-04-10 | ドライエツチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61235575A true JPS61235575A (ja) | 1986-10-20 |
JPS64470B2 JPS64470B2 (enrdf_load_stackoverflow) | 1989-01-06 |
Family
ID=13545500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7438085A Granted JPS61235575A (ja) | 1985-04-10 | 1985-04-10 | ドライエツチング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61235575A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897171A (en) * | 1985-11-26 | 1990-01-30 | Tadahiro Ohmi | Wafer susceptor |
-
1985
- 1985-04-10 JP JP7438085A patent/JPS61235575A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897171A (en) * | 1985-11-26 | 1990-01-30 | Tadahiro Ohmi | Wafer susceptor |
Also Published As
Publication number | Publication date |
---|---|
JPS64470B2 (enrdf_load_stackoverflow) | 1989-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |