JPS61234550A - チツプキヤリア - Google Patents

チツプキヤリア

Info

Publication number
JPS61234550A
JPS61234550A JP60077229A JP7722985A JPS61234550A JP S61234550 A JPS61234550 A JP S61234550A JP 60077229 A JP60077229 A JP 60077229A JP 7722985 A JP7722985 A JP 7722985A JP S61234550 A JPS61234550 A JP S61234550A
Authority
JP
Japan
Prior art keywords
cap
semiconductor component
compound
semiconductor part
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60077229A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455337B2 (cg-RX-API-DMAC10.html
Inventor
Mutsuo Tsuji
睦夫 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60077229A priority Critical patent/JPS61234550A/ja
Priority to FR8513819A priority patent/FR2570383B1/fr
Publication of JPS61234550A publication Critical patent/JPS61234550A/ja
Publication of JPH0455337B2 publication Critical patent/JPH0455337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/70—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60077229A 1984-09-20 1985-04-11 チツプキヤリア Granted JPS61234550A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア
FR8513819A FR2570383B1 (fr) 1984-09-20 1985-09-18 Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS61234550A true JPS61234550A (ja) 1986-10-18
JPH0455337B2 JPH0455337B2 (cg-RX-API-DMAC10.html) 1992-09-03

Family

ID=13628027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077229A Granted JPS61234550A (ja) 1984-09-20 1985-04-11 チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS61234550A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738009A (ja) * 1993-06-25 1995-02-07 Matsushita Electric Works Ltd チップキャリア
EP0786806A1 (en) * 1996-01-23 1997-07-30 Montpellier Technologies High I/O density package for high power wire-bonded IC chips and method for making the same
KR20020068208A (ko) * 2001-02-20 2002-08-27 에쓰에쓰아이 주식회사 반도체 조립체의 방열판 구조 및 그 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738009A (ja) * 1993-06-25 1995-02-07 Matsushita Electric Works Ltd チップキャリア
EP0786806A1 (en) * 1996-01-23 1997-07-30 Montpellier Technologies High I/O density package for high power wire-bonded IC chips and method for making the same
KR20020068208A (ko) * 2001-02-20 2002-08-27 에쓰에쓰아이 주식회사 반도체 조립체의 방열판 구조 및 그 제조 방법

Also Published As

Publication number Publication date
JPH0455337B2 (cg-RX-API-DMAC10.html) 1992-09-03

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