JPH034039Y2 - - Google Patents
Info
- Publication number
- JPH034039Y2 JPH034039Y2 JP1983123324U JP12332483U JPH034039Y2 JP H034039 Y2 JPH034039 Y2 JP H034039Y2 JP 1983123324 U JP1983123324 U JP 1983123324U JP 12332483 U JP12332483 U JP 12332483U JP H034039 Y2 JPH034039 Y2 JP H034039Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat
- chip carrier
- heat diffusion
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
-
- H10W72/931—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983123324U JPS6033437U (ja) | 1983-08-10 | 1983-08-10 | リ−ド無しチップキャリヤ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983123324U JPS6033437U (ja) | 1983-08-10 | 1983-08-10 | リ−ド無しチップキャリヤ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6033437U JPS6033437U (ja) | 1985-03-07 |
| JPH034039Y2 true JPH034039Y2 (cg-RX-API-DMAC10.html) | 1991-02-01 |
Family
ID=30281557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983123324U Granted JPS6033437U (ja) | 1983-08-10 | 1983-08-10 | リ−ド無しチップキャリヤ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033437U (cg-RX-API-DMAC10.html) |
-
1983
- 1983-08-10 JP JP1983123324U patent/JPS6033437U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6033437U (ja) | 1985-03-07 |
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