JPS6122878B2 - - Google Patents

Info

Publication number
JPS6122878B2
JPS6122878B2 JP55149415A JP14941580A JPS6122878B2 JP S6122878 B2 JPS6122878 B2 JP S6122878B2 JP 55149415 A JP55149415 A JP 55149415A JP 14941580 A JP14941580 A JP 14941580A JP S6122878 B2 JPS6122878 B2 JP S6122878B2
Authority
JP
Japan
Prior art keywords
solder
chip
substrate
attached
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55149415A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5773947A (en
Inventor
Masaru Sakaguchi
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55149415A priority Critical patent/JPS5773947A/ja
Publication of JPS5773947A publication Critical patent/JPS5773947A/ja
Publication of JPS6122878B2 publication Critical patent/JPS6122878B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H10W72/07236—
    • H10W72/252—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP55149415A 1980-10-27 1980-10-27 Formation of hybrid ic module Granted JPS5773947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55149415A JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55149415A JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Publications (2)

Publication Number Publication Date
JPS5773947A JPS5773947A (en) 1982-05-08
JPS6122878B2 true JPS6122878B2 (enExample) 1986-06-03

Family

ID=15474611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55149415A Granted JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Country Status (1)

Country Link
JP (1) JPS5773947A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065594A (ja) * 1983-09-20 1985-04-15 株式会社富士通ゼネラル 回路基板の接続方法
JPS63152136A (ja) * 1986-12-17 1988-06-24 Fuji Electric Co Ltd 半導体チツプの実装方法
JPS6428931A (en) * 1987-07-24 1989-01-31 Nec Corp Semiconductor device
JP2001358452A (ja) * 2000-06-15 2001-12-26 Murata Mfg Co Ltd 電子部品の実装方法
EP1289013A1 (en) * 2001-08-15 2003-03-05 Datamars SA A method for applying a semiconductor chip to a substrate and an assembly obtained thereby

Also Published As

Publication number Publication date
JPS5773947A (en) 1982-05-08

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