JPS6122459B2 - - Google Patents

Info

Publication number
JPS6122459B2
JPS6122459B2 JP56068138A JP6813881A JPS6122459B2 JP S6122459 B2 JPS6122459 B2 JP S6122459B2 JP 56068138 A JP56068138 A JP 56068138A JP 6813881 A JP6813881 A JP 6813881A JP S6122459 B2 JPS6122459 B2 JP S6122459B2
Authority
JP
Japan
Prior art keywords
brazing
layer
semiconductor substrate
substrate
filler metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56068138A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57183042A (en
Inventor
Noboru Baba
Hiroshi Soeno
Hitoshi Oonuki
Masateru Suwa
Kenichi Kizawa
Keiichi Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56068138A priority Critical patent/JPS57183042A/ja
Publication of JPS57183042A publication Critical patent/JPS57183042A/ja
Publication of JPS6122459B2 publication Critical patent/JPS6122459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/073
    • H10W72/07337
    • H10W72/352

Landscapes

  • Die Bonding (AREA)
JP56068138A 1981-05-08 1981-05-08 Semiconductor device Granted JPS57183042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56068138A JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56068138A JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57183042A JPS57183042A (en) 1982-11-11
JPS6122459B2 true JPS6122459B2 (OSRAM) 1986-05-31

Family

ID=13365079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56068138A Granted JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57183042A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187051U (OSRAM) * 1984-11-15 1986-06-07

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050440B2 (ja) * 2006-08-01 2012-10-17 日産自動車株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187051U (OSRAM) * 1984-11-15 1986-06-07

Also Published As

Publication number Publication date
JPS57183042A (en) 1982-11-11

Similar Documents

Publication Publication Date Title
EP0070435B1 (en) Semiconductor device comprising a semiconductor substrate bonded to a mounting means
TWI440068B (zh) 基材接合方法以及半導體元件
JP2009125753A (ja) はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
WO1991009421A1 (en) Packaged diode for high temperature operation
WO2013172394A1 (ja) 半導体装置
US6376910B1 (en) Solder-on back metal for semiconductor die
JP4915011B2 (ja) 金属−セラミックス接合基板
US11712760B2 (en) Layered bonding material, semiconductor package, and power module
JP2009129983A (ja) 接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
US11195815B2 (en) Semiconductor device and manufacturing method thereof with Cu and Sn intermetallic compound
JPS6141135B2 (OSRAM)
JP5723225B2 (ja) 接合構造体
JPS6122459B2 (OSRAM)
JPH0133278B2 (OSRAM)
JP2011199315A (ja) 金属−セラミックス接合基板
JP7169187B2 (ja) パワーモジュール
US5380598A (en) Solder joint
JPS6035822B2 (ja) 半導体装置
US4921158A (en) Brazing material
JPH05218454A (ja) 半導体装置
WO2021019891A1 (ja) 熱電モジュール及び熱電モジュールの製造方法
JPS606117B2 (ja) 注入型半導体発光素子
JP5062545B2 (ja) サブマウント及びその製造方法
JP4528510B2 (ja) 半導体レーザ素子用サブマウント
JPS635550A (ja) 半導体装置