JPS6120361A - 半導体装置用リ−ドフレ−ムの製造方法 - Google Patents
半導体装置用リ−ドフレ−ムの製造方法Info
- Publication number
- JPS6120361A JPS6120361A JP14200084A JP14200084A JPS6120361A JP S6120361 A JPS6120361 A JP S6120361A JP 14200084 A JP14200084 A JP 14200084A JP 14200084 A JP14200084 A JP 14200084A JP S6120361 A JPS6120361 A JP S6120361A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- metal mold
- press
- press metal
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000002184 metal Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14200084A JPS6120361A (ja) | 1984-07-09 | 1984-07-09 | 半導体装置用リ−ドフレ−ムの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14200084A JPS6120361A (ja) | 1984-07-09 | 1984-07-09 | 半導体装置用リ−ドフレ−ムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6120361A true JPS6120361A (ja) | 1986-01-29 |
JPH0457106B2 JPH0457106B2 (enrdf_load_html_response) | 1992-09-10 |
Family
ID=15305053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14200084A Granted JPS6120361A (ja) | 1984-07-09 | 1984-07-09 | 半導体装置用リ−ドフレ−ムの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6120361A (enrdf_load_html_response) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229844A (ja) * | 1987-03-19 | 1988-09-26 | Nec Corp | 半導体装置の製造方法 |
US5295296A (en) * | 1990-02-06 | 1994-03-22 | Citizen Watch Co., Ltd. | Method and apparatus for working a clad material |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522752A (en) * | 1975-06-24 | 1977-01-10 | Fueroo Kogyo Kk | Static capacity type level gauge provided with digital switch |
-
1984
- 1984-07-09 JP JP14200084A patent/JPS6120361A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522752A (en) * | 1975-06-24 | 1977-01-10 | Fueroo Kogyo Kk | Static capacity type level gauge provided with digital switch |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229844A (ja) * | 1987-03-19 | 1988-09-26 | Nec Corp | 半導体装置の製造方法 |
US5295296A (en) * | 1990-02-06 | 1994-03-22 | Citizen Watch Co., Ltd. | Method and apparatus for working a clad material |
Also Published As
Publication number | Publication date |
---|---|
JPH0457106B2 (enrdf_load_html_response) | 1992-09-10 |
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