JPS61198625A - 半導体装置の製法及びそれに使用する赤外線ランプ加熱装置 - Google Patents
半導体装置の製法及びそれに使用する赤外線ランプ加熱装置Info
- Publication number
- JPS61198625A JPS61198625A JP19692285A JP19692285A JPS61198625A JP S61198625 A JPS61198625 A JP S61198625A JP 19692285 A JP19692285 A JP 19692285A JP 19692285 A JP19692285 A JP 19692285A JP S61198625 A JPS61198625 A JP S61198625A
- Authority
- JP
- Japan
- Prior art keywords
- infrared lamp
- ion
- irradiation
- substrate
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 13
- 150000002500 ions Chemical class 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000000137 annealing Methods 0.000 abstract description 23
- 238000005468 ion implantation Methods 0.000 abstract description 13
- 239000013078 crystal Substances 0.000 abstract description 12
- 230000004913 activation Effects 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 8
- 238000009826 distribution Methods 0.000 abstract description 5
- -1 GaAs compound Chemical class 0.000 description 8
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000005224 laser annealing Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000003376 silicon Chemical class 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19692285A JPS61198625A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製法及びそれに使用する赤外線ランプ加熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19692285A JPS61198625A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製法及びそれに使用する赤外線ランプ加熱装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16374679A Division JPS56100412A (en) | 1979-12-17 | 1979-12-17 | Manufacture of semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP549788A Division JPS63170916A (ja) | 1988-01-13 | 1988-01-13 | 赤外線ランプ加熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61198625A true JPS61198625A (ja) | 1986-09-03 |
JPH0210569B2 JPH0210569B2 (enrdf_load_stackoverflow) | 1990-03-08 |
Family
ID=16365898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19692285A Granted JPS61198625A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製法及びそれに使用する赤外線ランプ加熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61198625A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003338561A (ja) * | 2002-05-20 | 2003-11-28 | Hynix Semiconductor Inc | 半導体素子のトランジスタ形成方法 |
US7381598B2 (en) | 1993-08-12 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Insulated gate semiconductor device and process for fabricating the same |
JP2016207505A (ja) * | 2015-04-23 | 2016-12-08 | 日本碍子株式会社 | 赤外線ヒーター及び赤外線処理装置 |
-
1985
- 1985-09-06 JP JP19692285A patent/JPS61198625A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7381598B2 (en) | 1993-08-12 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Insulated gate semiconductor device and process for fabricating the same |
JP2003338561A (ja) * | 2002-05-20 | 2003-11-28 | Hynix Semiconductor Inc | 半導体素子のトランジスタ形成方法 |
JP2016207505A (ja) * | 2015-04-23 | 2016-12-08 | 日本碍子株式会社 | 赤外線ヒーター及び赤外線処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0210569B2 (enrdf_load_stackoverflow) | 1990-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4482393A (en) | Method of activating implanted ions by incoherent light beam | |
EP0146233B1 (en) | Low temperature process for annealing shallow implanted n+/p junctions | |
US4659422A (en) | Process for producing monocrystalline layer on insulator | |
JPS58223320A (ja) | 不純物拡散方法 | |
US4468259A (en) | Uniform wafer heating by controlling light source and circumferential heating of wafer | |
US4504730A (en) | Method for heating semiconductor wafer by means of application of radiated light | |
JPS605014A (ja) | 多色輻射の照射による金属ケイ化物層の生成方法 | |
US5219798A (en) | Method of heating a semiconductor substrate capable of preventing defects in crystal from occurring | |
JPS61198625A (ja) | 半導体装置の製法及びそれに使用する赤外線ランプ加熱装置 | |
JPH0377657B2 (enrdf_load_stackoverflow) | ||
JPS59178718A (ja) | 半導体基体の処理装置 | |
JPS6476737A (en) | Manufacture of semiconductor integrated circuit device | |
JPS61116820A (ja) | 半導体のアニ−ル方法 | |
JP2813990B2 (ja) | 窒化ホウ素を用いた電子装置の作製方法 | |
JPS63170916A (ja) | 赤外線ランプ加熱装置 | |
Robinson | Laser annealing: Processing semiconductors without a furnace | |
JP2530158B2 (ja) | 透明基板の選択的加熱方法 | |
JP2530157B2 (ja) | 透明基板の選択的加熱方法 | |
JP2613555B2 (ja) | 不純物低温拡散方法及び不純物低温拡散装置 | |
JPH11195613A (ja) | 紫外線アニール装置およびアニール方法 | |
JPS6250971B2 (enrdf_load_stackoverflow) | ||
JPS62271420A (ja) | 半導体基体の処理装置 | |
JPH025295B2 (enrdf_load_stackoverflow) | ||
JP2000331950A (ja) | 半導体への不純物ドーピング方法及び半導体装置製造方法 | |
JPH06508957A (ja) | 固体ドーパントソースと急速熱処理を使用してシリコンウェーハをドープする方法と装置 |