JPS6119158A - ボンデイングワイヤ− - Google Patents

ボンデイングワイヤ−

Info

Publication number
JPS6119158A
JPS6119158A JP59139110A JP13911084A JPS6119158A JP S6119158 A JPS6119158 A JP S6119158A JP 59139110 A JP59139110 A JP 59139110A JP 13911084 A JP13911084 A JP 13911084A JP S6119158 A JPS6119158 A JP S6119158A
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
strength
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59139110A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572750B2 (enExample
Inventor
Shigemi Yamane
山根　茂美
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59139110A priority Critical patent/JPS6119158A/ja
Publication of JPS6119158A publication Critical patent/JPS6119158A/ja
Publication of JPH0572750B2 publication Critical patent/JPH0572750B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59139110A 1984-07-06 1984-07-06 ボンデイングワイヤ− Granted JPS6119158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59139110A JPS6119158A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59139110A JPS6119158A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5054660A Division JPH0727922B2 (ja) 1993-02-22 1993-02-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS6119158A true JPS6119158A (ja) 1986-01-28
JPH0572750B2 JPH0572750B2 (enExample) 1993-10-12

Family

ID=15237714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139110A Granted JPS6119158A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6119158A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633424A (ja) * 1986-06-24 1988-01-08 Tatsuta Electric Wire & Cable Co Ltd 配線性に優れた半導体素子用銅ボンディング線の製造方法
JPH02211788A (ja) * 1989-02-13 1990-08-23 Hitachi Ltd 逆磁場発生装置
US4974472A (en) * 1987-02-13 1990-12-04 Honda Giken Kogyo Kabushiki Kaisha Hydraulic power transmission apparatus
US5230519A (en) * 1988-02-16 1993-07-27 Honda Giken Kogyo Kabushiki Kaisha Hydraulically operated power transmission apparatus
CN103137235A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的二次合金1n铜线
CN108962860A (zh) * 2018-08-15 2018-12-07 芜湖长润特种铜线有限公司 一种耐氧化键合铜丝材料的制备方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633424A (ja) * 1986-06-24 1988-01-08 Tatsuta Electric Wire & Cable Co Ltd 配線性に優れた半導体素子用銅ボンディング線の製造方法
US4974472A (en) * 1987-02-13 1990-12-04 Honda Giken Kogyo Kabushiki Kaisha Hydraulic power transmission apparatus
US5230519A (en) * 1988-02-16 1993-07-27 Honda Giken Kogyo Kabushiki Kaisha Hydraulically operated power transmission apparatus
JPH02211788A (ja) * 1989-02-13 1990-08-23 Hitachi Ltd 逆磁場発生装置
CN103137235A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的二次合金1n铜线
CN108962860A (zh) * 2018-08-15 2018-12-07 芜湖长润特种铜线有限公司 一种耐氧化键合铜丝材料的制备方法

Also Published As

Publication number Publication date
JPH0572750B2 (enExample) 1993-10-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees