JPS6119101B2 - - Google Patents

Info

Publication number
JPS6119101B2
JPS6119101B2 JP54112473A JP11247379A JPS6119101B2 JP S6119101 B2 JPS6119101 B2 JP S6119101B2 JP 54112473 A JP54112473 A JP 54112473A JP 11247379 A JP11247379 A JP 11247379A JP S6119101 B2 JPS6119101 B2 JP S6119101B2
Authority
JP
Japan
Prior art keywords
aluminum
wafer
tube
diffusion
aluminum source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54112473A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5548925A (en
Inventor
Futsushingu Changu Maiku
Roosuchi Arufuretsudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5548925A publication Critical patent/JPS5548925A/ja
Publication of JPS6119101B2 publication Critical patent/JPS6119101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/12—Diffusion of dopants within, into or out of semiconductor bodies or layers between a solid phase and a gaseous phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/033—Diffusion of aluminum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S252/00—Compositions
    • Y10S252/95—Doping agent source material
    • Y10S252/951—Doping agent source material for vapor transport
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/909—Controlled atmosphere

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Die Bonding (AREA)
JP11247379A 1978-09-05 1979-09-04 Method of diffusing open tube aluminum Granted JPS5548925A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/939,669 US4235650A (en) 1978-09-05 1978-09-05 Open tube aluminum diffusion

Publications (2)

Publication Number Publication Date
JPS5548925A JPS5548925A (en) 1980-04-08
JPS6119101B2 true JPS6119101B2 (enExample) 1986-05-15

Family

ID=25473553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11247379A Granted JPS5548925A (en) 1978-09-05 1979-09-04 Method of diffusing open tube aluminum

Country Status (5)

Country Link
US (1) US4235650A (enExample)
JP (1) JPS5548925A (enExample)
DE (1) DE2931432C2 (enExample)
FR (1) FR2435817A1 (enExample)
GB (1) GB2034113B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0061787B1 (de) * 1981-03-02 1985-11-21 BBC Aktiengesellschaft Brown, Boveri & Cie. Verfahren zum Dotieren von Trägern aus Silicium für die Halbleiterfertigung
JPS60120799U (ja) * 1984-01-21 1985-08-15 シ−　チン−ヤン 回転式高速自動スライサ−
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
KR890001502B1 (ko) * 1985-06-24 1989-05-06 씨.에프.엠 테크늘러지즈 인코포레이티드 반도체 웨이퍼 흐름 처리공정 및 그 장치
EP0263270B1 (de) * 1986-09-30 1992-11-11 Siemens Aktiengesellschaft Verfahren zum Erzeugen eines p-dotierten Halbleitergebiets in einem n-leitenden Halbleiterkörper
WO1993006949A1 (en) * 1991-10-04 1993-04-15 Cfm Technologies, Inc. Ultracleaning of involuted microparts
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
FI117728B (fi) * 2004-12-21 2007-01-31 Planar Systems Oy Monikerrosmateriaali ja menetelmä sen valmistamiseksi
JP2012119453A (ja) * 2010-11-30 2012-06-21 Mitsubishi Electric Corp 不純物拡散装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374125A (en) * 1965-05-10 1968-03-19 Rca Corp Method of forming a pn junction by vaporization
US3589953A (en) * 1968-02-14 1971-06-29 Gen Motors Corp Vapor diffusion system for semiconductors
GB1199399A (en) * 1968-06-21 1970-07-22 Matsushita Electronics Corp Improvements in or relating to the Manufacture of Semiconductors.
US3852128A (en) * 1969-02-22 1974-12-03 Licentia Gmbh Method of diffusing impurities into semiconductor wafers
SU326915A1 (enExample) * 1970-04-06 1974-06-15 Н. П. Молибог, А. Н. Думаневич, В. Е. Челноков, Н. И. Якивчик, Н. П. Сахарова , В. В. Толкунов
US3972838A (en) * 1973-11-01 1976-08-03 Denki Kagaku Kogyo Kabushiki Kaisha Composition for diffusing phosphorus
US3997379A (en) * 1975-06-20 1976-12-14 Rca Corporation Diffusion of conductivity modifiers into a semiconductor body
CA1065498A (en) * 1975-10-07 1979-10-30 Rathindra N. Ghoshtagore Open tube gallium diffusion process for semiconductor devices

Also Published As

Publication number Publication date
FR2435817B1 (enExample) 1984-10-19
DE2931432A1 (de) 1980-03-20
FR2435817A1 (fr) 1980-04-04
JPS5548925A (en) 1980-04-08
DE2931432C2 (de) 1987-04-02
GB2034113A (en) 1980-05-29
GB2034113B (en) 1983-04-13
US4235650A (en) 1980-11-25

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