JPS6118937B2 - - Google Patents

Info

Publication number
JPS6118937B2
JPS6118937B2 JP4442880A JP4442880A JPS6118937B2 JP S6118937 B2 JPS6118937 B2 JP S6118937B2 JP 4442880 A JP4442880 A JP 4442880A JP 4442880 A JP4442880 A JP 4442880A JP S6118937 B2 JPS6118937 B2 JP S6118937B2
Authority
JP
Japan
Prior art keywords
resin
polyphenylene ether
resin composition
group
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4442880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56141349A (en
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP4442880A priority Critical patent/JPS56141349A/ja
Priority to US06/246,314 priority patent/US4389516A/en
Priority to DE19813111403 priority patent/DE3111403A1/de
Publication of JPS56141349A publication Critical patent/JPS56141349A/ja
Publication of JPS6118937B2 publication Critical patent/JPS6118937B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP4442880A 1980-03-24 1980-04-03 Curable polyphenylene ether type resin composition Granted JPS56141349A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4442880A JPS56141349A (en) 1980-04-03 1980-04-03 Curable polyphenylene ether type resin composition
US06/246,314 US4389516A (en) 1980-03-24 1981-03-23 Curable polyphenylene ether resin composition
DE19813111403 DE3111403A1 (de) 1980-03-24 1981-03-23 Haertbare polyphenylenaetherharzmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4442880A JPS56141349A (en) 1980-04-03 1980-04-03 Curable polyphenylene ether type resin composition

Publications (2)

Publication Number Publication Date
JPS56141349A JPS56141349A (en) 1981-11-05
JPS6118937B2 true JPS6118937B2 (US06770691-20040803-C00001.png) 1986-05-15

Family

ID=12691213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4442880A Granted JPS56141349A (en) 1980-03-24 1980-04-03 Curable polyphenylene ether type resin composition

Country Status (1)

Country Link
JP (1) JPS56141349A (US06770691-20040803-C00001.png)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128909A (ja) * 2001-10-23 2003-05-08 Asahi Kasei Corp 難燃性熱硬化樹脂組成物
WO2007094359A1 (ja) 2006-02-17 2007-08-23 Hitachi Chemical Co., Ltd. セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
WO2008136373A1 (ja) 2007-04-26 2008-11-13 Hitachi Chemical Company, Ltd. セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
US9828466B2 (en) 2014-04-04 2017-11-28 Hitachi Chemical Company, Ltd Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
WO2018016530A1 (ja) 2016-07-20 2018-01-25 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
WO2018105070A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 樹脂ワニス、プリプレグ、積層板及びプリント配線板
WO2018105071A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板
US11339251B2 (en) 2016-07-05 2022-05-24 Showa Denko Materials Co., Ltd. Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
US11377546B2 (en) 2016-07-19 2022-07-05 Showa Denko Materials Co., Ltd. Resin composition, laminate sheet, and multilayer printed wiring board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
US7071266B2 (en) * 2003-01-17 2006-07-04 Mitsubishi Gas Chemical Company, Inc. Curable resin composition and cured product thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128909A (ja) * 2001-10-23 2003-05-08 Asahi Kasei Corp 難燃性熱硬化樹脂組成物
WO2007094359A1 (ja) 2006-02-17 2007-08-23 Hitachi Chemical Co., Ltd. セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
EP2407503A1 (en) 2006-02-17 2012-01-18 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
EP2546287A1 (en) 2006-02-17 2013-01-16 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same
WO2008136373A1 (ja) 2007-04-26 2008-11-13 Hitachi Chemical Company, Ltd. セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
US9828466B2 (en) 2014-04-04 2017-11-28 Hitachi Chemical Company, Ltd Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
US11339251B2 (en) 2016-07-05 2022-05-24 Showa Denko Materials Co., Ltd. Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
US11377546B2 (en) 2016-07-19 2022-07-05 Showa Denko Materials Co., Ltd. Resin composition, laminate sheet, and multilayer printed wiring board
WO2018016530A1 (ja) 2016-07-20 2018-01-25 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
US10907029B2 (en) 2016-07-20 2021-02-02 Showa Denko Materials Co., Ltd. Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
US10940674B2 (en) 2016-12-07 2021-03-09 Showa Denko Materials Co., Ltd. Resin varnish, prepreg, laminate, and printed wiring board
US11136454B2 (en) 2016-12-07 2021-10-05 Showa Denko Materials Co., Ltd. Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
WO2018105071A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板
WO2018105070A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 樹脂ワニス、プリプレグ、積層板及びプリント配線板

Also Published As

Publication number Publication date
JPS56141349A (en) 1981-11-05

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