JPS61188996A - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JPS61188996A JPS61188996A JP2846185A JP2846185A JPS61188996A JP S61188996 A JPS61188996 A JP S61188996A JP 2846185 A JP2846185 A JP 2846185A JP 2846185 A JP2846185 A JP 2846185A JP S61188996 A JPS61188996 A JP S61188996A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- hole
- resin
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000005553 drilling Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2846185A JPS61188996A (ja) | 1985-02-18 | 1985-02-18 | プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2846185A JPS61188996A (ja) | 1985-02-18 | 1985-02-18 | プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61188996A true JPS61188996A (ja) | 1986-08-22 |
| JPS645478B2 JPS645478B2 (enrdf_load_stackoverflow) | 1989-01-30 |
Family
ID=12249302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2846185A Granted JPS61188996A (ja) | 1985-02-18 | 1985-02-18 | プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188996A (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5356983A (en) * | 1976-11-02 | 1978-05-23 | Sharp Corp | Multilayer wiring substrate |
| JPS53117741A (en) * | 1977-03-24 | 1978-10-14 | Sharp Kk | Multilayer circuit board |
| JPS54157268A (en) * | 1978-06-02 | 1979-12-12 | Oki Electric Ind Co Ltd | Metal plate compound multilayer flexible board |
| JPS605598A (ja) * | 1983-06-23 | 1985-01-12 | 松下電器産業株式会社 | 高熱伝導性金属ベ−スプリント基板の製造方法 |
-
1985
- 1985-02-18 JP JP2846185A patent/JPS61188996A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5356983A (en) * | 1976-11-02 | 1978-05-23 | Sharp Corp | Multilayer wiring substrate |
| JPS53117741A (en) * | 1977-03-24 | 1978-10-14 | Sharp Kk | Multilayer circuit board |
| JPS54157268A (en) * | 1978-06-02 | 1979-12-12 | Oki Electric Ind Co Ltd | Metal plate compound multilayer flexible board |
| JPS605598A (ja) * | 1983-06-23 | 1985-01-12 | 松下電器産業株式会社 | 高熱伝導性金属ベ−スプリント基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS645478B2 (enrdf_load_stackoverflow) | 1989-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |