JPS61187336A - プラズマエッチング装置とエッチング方法 - Google Patents

プラズマエッチング装置とエッチング方法

Info

Publication number
JPS61187336A
JPS61187336A JP60029072A JP2907285A JPS61187336A JP S61187336 A JPS61187336 A JP S61187336A JP 60029072 A JP60029072 A JP 60029072A JP 2907285 A JP2907285 A JP 2907285A JP S61187336 A JPS61187336 A JP S61187336A
Authority
JP
Japan
Prior art keywords
plasma
magnetic field
electromagnets
etching
matters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60029072A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573051B2 (enExample
Inventor
Akira Chiba
明 千葉
Kiyoshi Sakagami
阪上　潔
Hideaki Itakura
秀明 板倉
Shigeki Sadahiro
貞廣　茂樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60029072A priority Critical patent/JPS61187336A/ja
Publication of JPS61187336A publication Critical patent/JPS61187336A/ja
Publication of JPH0573051B2 publication Critical patent/JPH0573051B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP60029072A 1985-02-15 1985-02-15 プラズマエッチング装置とエッチング方法 Granted JPS61187336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60029072A JPS61187336A (ja) 1985-02-15 1985-02-15 プラズマエッチング装置とエッチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60029072A JPS61187336A (ja) 1985-02-15 1985-02-15 プラズマエッチング装置とエッチング方法

Publications (2)

Publication Number Publication Date
JPS61187336A true JPS61187336A (ja) 1986-08-21
JPH0573051B2 JPH0573051B2 (enExample) 1993-10-13

Family

ID=12266149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60029072A Granted JPS61187336A (ja) 1985-02-15 1985-02-15 プラズマエッチング装置とエッチング方法

Country Status (1)

Country Link
JP (1) JPS61187336A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224231A (ja) * 1987-03-12 1988-09-19 Fujitsu Ltd エツチング装置
JPS63255383A (ja) * 1987-04-13 1988-10-21 Anelva Corp 放電化学反応装置
JPS63277778A (ja) * 1987-05-08 1988-11-15 Anelva Corp 放電化学反応装置の回転磁界発生装置
US5444207A (en) * 1992-03-26 1995-08-22 Kabushiki Kaisha Toshiba Plasma generating device and surface processing device and method for processing wafers in a uniform magnetic field
US5558749A (en) * 1994-07-08 1996-09-24 Matsushita Electric Industrial Co., Ltd. Magnetron sputtering apparatus and method
US5660744A (en) * 1992-03-26 1997-08-26 Kabushiki Kaisha Toshiba Plasma generating apparatus and surface processing apparatus
US6261428B1 (en) * 1991-08-20 2001-07-17 Tokyo Electron Limited Magnetron plasma process apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918638A (ja) * 1982-07-22 1984-01-31 Toshiba Corp ドライエツチング装置
JPS59139629A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd プラズマドライ処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918638A (ja) * 1982-07-22 1984-01-31 Toshiba Corp ドライエツチング装置
JPS59139629A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd プラズマドライ処理装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224231A (ja) * 1987-03-12 1988-09-19 Fujitsu Ltd エツチング装置
JPS63255383A (ja) * 1987-04-13 1988-10-21 Anelva Corp 放電化学反応装置
JPS63277778A (ja) * 1987-05-08 1988-11-15 Anelva Corp 放電化学反応装置の回転磁界発生装置
US6261428B1 (en) * 1991-08-20 2001-07-17 Tokyo Electron Limited Magnetron plasma process apparatus
US5444207A (en) * 1992-03-26 1995-08-22 Kabushiki Kaisha Toshiba Plasma generating device and surface processing device and method for processing wafers in a uniform magnetic field
US5660744A (en) * 1992-03-26 1997-08-26 Kabushiki Kaisha Toshiba Plasma generating apparatus and surface processing apparatus
US5558749A (en) * 1994-07-08 1996-09-24 Matsushita Electric Industrial Co., Ltd. Magnetron sputtering apparatus and method

Also Published As

Publication number Publication date
JPH0573051B2 (enExample) 1993-10-13

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