JPS61187260A - 集積回路の実装構造 - Google Patents
集積回路の実装構造Info
- Publication number
- JPS61187260A JPS61187260A JP2722085A JP2722085A JPS61187260A JP S61187260 A JPS61187260 A JP S61187260A JP 2722085 A JP2722085 A JP 2722085A JP 2722085 A JP2722085 A JP 2722085A JP S61187260 A JPS61187260 A JP S61187260A
- Authority
- JP
- Japan
- Prior art keywords
- cooling plate
- integrated circuit
- holding frame
- kerfs
- substrate holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000005489 elastic deformation Effects 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 239000006243 Fine Thermal Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 101000694017 Homo sapiens Sodium channel protein type 5 subunit alpha Proteins 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2722085A JPS61187260A (ja) | 1985-02-14 | 1985-02-14 | 集積回路の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2722085A JPS61187260A (ja) | 1985-02-14 | 1985-02-14 | 集積回路の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61187260A true JPS61187260A (ja) | 1986-08-20 |
| JPH0426552B2 JPH0426552B2 (enrdf_load_stackoverflow) | 1992-05-07 |
Family
ID=12215014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2722085A Granted JPS61187260A (ja) | 1985-02-14 | 1985-02-14 | 集積回路の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61187260A (enrdf_load_stackoverflow) |
-
1985
- 1985-02-14 JP JP2722085A patent/JPS61187260A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426552B2 (enrdf_load_stackoverflow) | 1992-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3422675B2 (ja) | 電子集積回路パッケージ | |
| JPH0247895A (ja) | 放熱板 | |
| JPS61187260A (ja) | 集積回路の実装構造 | |
| JP2816069B2 (ja) | 電子部品の放熱装置 | |
| JPS61292944A (ja) | 集積回路パツケ−ジの液体冷却構造 | |
| JPH11312770A (ja) | 薄型ｉｃの放熱フィン | |
| JP3523094B2 (ja) | 半導体装置 | |
| CN2461058Y (zh) | Cpu散热器固定结构 | |
| JPH08228045A (ja) | 半導体レーザのマウント構造 | |
| JPH0563053U (ja) | 混成集積回路基板 | |
| JP3577338B2 (ja) | 電子機器の放熱板 | |
| JPS6151947A (ja) | 半導体装置 | |
| JPS63140556A (ja) | 半導体装置 | |
| JPH08204371A (ja) | 電子部品の放熱構造 | |
| JPH06181395A (ja) | 放熱形プリント配線板 | |
| KR910003792A (ko) | 전력 반도체 패키지 | |
| JPH1126960A (ja) | 基板取付装置 | |
| JPH0265199A (ja) | フェライトビーズコア付き放熱スペーサー | |
| JP2000228595A (ja) | ヒートシンク | |
| JPH11204967A (ja) | 半導体装置 | |
| JPH01318259A (ja) | 混成集積回路装置 | |
| JPH084117B2 (ja) | 半導体装置の製造方法 | |
| JPS62243399A (ja) | プリント基板支持装置 | |
| JPS60259470A (ja) | サ−マルプリンテイングヘツド | |
| JP2002164483A (ja) | 冷却装置 |