JPS61186165A - フラツクスの塗布方法 - Google Patents
フラツクスの塗布方法Info
- Publication number
- JPS61186165A JPS61186165A JP2558085A JP2558085A JPS61186165A JP S61186165 A JPS61186165 A JP S61186165A JP 2558085 A JP2558085 A JP 2558085A JP 2558085 A JP2558085 A JP 2558085A JP S61186165 A JPS61186165 A JP S61186165A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- wiring board
- board
- powder
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title claims abstract description 75
- 238000000576 coating method Methods 0.000 title abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000003595 mist Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 description 19
- 238000005476 soldering Methods 0.000 description 12
- 238000005187 foaming Methods 0.000 description 10
- 230000006698 induction Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2558085A JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2558085A JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186165A true JPS61186165A (ja) | 1986-08-19 |
| JPH0551392B2 JPH0551392B2 (enrdf_load_stackoverflow) | 1993-08-02 |
Family
ID=12169855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2558085A Granted JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61186165A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0368192A (ja) * | 1988-04-06 | 1991-03-25 | American Teleph & Telegr Co <Att> | 融剤の基板への塗布方法およびその装置 |
| JPH0376658U (enrdf_load_stackoverflow) * | 1989-11-22 | 1991-07-31 | ||
| JPH0459171A (ja) * | 1990-06-28 | 1992-02-26 | Nec Corp | 噴霧式フラックス塗布装置 |
| JPH0494157U (enrdf_load_stackoverflow) * | 1991-01-09 | 1992-08-14 | ||
| CN106825836A (zh) * | 2015-10-22 | 2017-06-13 | 千住金属工业株式会社 | 焊剂回收装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147777U (enrdf_load_stackoverflow) * | 1979-04-09 | 1980-10-23 |
-
1985
- 1985-02-13 JP JP2558085A patent/JPS61186165A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147777U (enrdf_load_stackoverflow) * | 1979-04-09 | 1980-10-23 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0368192A (ja) * | 1988-04-06 | 1991-03-25 | American Teleph & Telegr Co <Att> | 融剤の基板への塗布方法およびその装置 |
| JPH0376658U (enrdf_load_stackoverflow) * | 1989-11-22 | 1991-07-31 | ||
| JPH0459171A (ja) * | 1990-06-28 | 1992-02-26 | Nec Corp | 噴霧式フラックス塗布装置 |
| JPH0494157U (enrdf_load_stackoverflow) * | 1991-01-09 | 1992-08-14 | ||
| CN106825836A (zh) * | 2015-10-22 | 2017-06-13 | 千住金属工业株式会社 | 焊剂回收装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0551392B2 (enrdf_load_stackoverflow) | 1993-08-02 |
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