JPS61182300A - Electronic component assembling apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an insertion mechanism for an electronic component with a lead, and in particular,
The present invention relates to an electronic component assembly device suitable for inserting multi-shaped electronic components with leads.

[Background of the invention]

A conventional device, as described in Japanese Patent Application Laid-Open No. 51-115655, was a system in which a lead is gripped by an insertion guide, the guide is positioned in close contact with a printed board, and an electronic component is pushed in with an insertion rod. However, when inserting multi-shaped leaded electronic components with different body sizes between already inserted electronic components, there is a problem that the insertion guide and insertion rod collide with the already inserted electronic components. . In other words, the electronic components with leads are coaxial type (axial)
, vertical (radial), etc., the tip of the insertion rod must be changed for each body shape, and the insertion guide must be inserted in close contact with the printed board, so it is necessary to This had the problem that high-density assembly was not possible because it collided with the parts.

[Purpose of the invention]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to place electronic components with multi-shaped leads in high density between inserted electronic components.
Another object of the present invention is to provide an electronic component incorporating device that can be stably inserted.

[Summary of the Invention] The present invention focuses on the fact that the leads of child components have relatively the same shape, and after inserting the tip of the lead into the printed board, grasps the component lead from the bottom of the printed board and pulls it down. After the electronic components are brought into close contact with the printed board, the leads are cut and bent to enable high-density integration.

[Embodiments of the invention]

An example of the overall configuration of the electronic component assembling apparatus of the present invention will be described with reference to FIG.

From the electronic component supply device 1, individual electronic components are sent to the pattern recognition head section 2, where their positions are confirmed, and then sent by the component picker 3 to the lead forming machine 4 for each component shape, where the leads are Leads are formed for each pitch and each molded shape, and the leads are inserted into the printed board 11 on the XY table 6 by the insertion head 5.

All of these mechanisms are controlled online in real time by the control device 7, and more than 100 types of electronic components of various types and shapes are processed from a parallax state to lead forming and insertion.

Here, the configuration and operating principle of the insertion head 5 for inserting multi-shaped electronic components in the electronic component assembly apparatus of the present invention will be explained with reference to FIGS. 1 and 3. Electronic components i, IC1 coaxial components, low vertical components, etc. differ in filter size, body shape and size, and lead diameter.

First, the electronic component 8 consists of a body and a lead 9, and the lead 9 is grabbed by the insertion arm 10.

The position of the tip of the lead 9 and the through hole 12 is confirmed with an optical center, the position is corrected, and the lead is inserted into the printed board 11. The puller 13 is the inserted lead 9
This is achieved by lowering the grip spacer 15. The cut and clinch device 16 cuts and bends the inserted lead 9.

Next, the process of inserting electronic components will be explained using FIG.

First, the lead 9 of the electronic component 8 is grasped by the insertion arm 10, the tip of the lead 9 and the position of the through hole 12 are confirmed with the optical center, the insertion arm 10 is lowered, and the tip of the lead 9 is inserted into the printed board 11. Insert into through hole 12 (■). Next, the inserted lead 9 enters the lead gripping portion 14 at the tip of the puller 13, and by lowering the gripping portion spacer 15, the tip of the lead 9 is gripped from the underside of the printed board 11 (@). Thereafter, the insertion arm 10 is released (θ) and the plastic plate 13 is lowered to lower the lead 9 (O).

With the lead 9 completely pulled down and the body of the electronic component 8 in close contact with the printed board 11, the cut-and-clinch device 16 is raised to cut and bend the lead 9 (@).

After the cut lead waste is removed by a vacuum tube, the cut and clinch device 16 and the puller 13 are returned to their original positions.
The X-Y table 6 is moved to prepare for the next through-hole insertion (θ), and the process returns to step (2) and is repeated.

In this example, the electronic components with leads are coaxial type (axial).
This method focuses on the fact that even if the body shape and size are different, regardless of the vertical type (radial), etc., the lead has a relatively constant shape, and by adopting the lead tension method, the body size can be adjusted. is minimum 3 wR ~ maximum 2
5mm, multi-shaped electronic components with lead diameters of 0.3' to 1.28't can be inserted with a minimum insertion pitch of 2.54wn, a minimum body spacing of 0.2rm, and a height of 7mm or less. The automatic insertion rate can be increased from about 70% to 95.

〔Effect of the invention〕

According to the present invention, the tips of the leads of multi-shaped electronic components are inserted into the printed board, the tips of the leads are pulled down from the bottom surface, and the electronic components are brought into close contact with the printed board before being cut and bent. High-density integration of electronic components can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram illustrating the mechanism of the electronic component assembly apparatus of the present invention, FIG. 2 is a diagram illustrating the overall configuration of the electronic component assembly apparatus, and FIG. FIG. 3 is a process diagram illustrating the operation of the embedded device. 5... Insertion head, 8... Electronic component, 9... Lead, 10... Insertion arm, 11... Printed board, 1
2... Through hole, 13... Puller, 14...
Lead gripping portion, 15...Gripping portion spacer, 16
...Cut and clinch device.

Claims (1)

[Claims] 1. Insert the multi-shaped leaded electronic component into the printed board,
In an electronic component assembly device that performs assembly, an insertion arm that grasps a lead of the electronic component and inserts the tip of the lead into a printed board; a lead lowering means that grasps and pulls down the lead of the electronic component with the tip inserted; An electronic component assembling device characterized by being provided with cutting and bending means for bringing the body of an electronic component into close contact with a printed board, and for fixing the electronic component by cutting and bending inserted leads.