JPH0251279B2 - - Google Patents

Info

Publication number
JPH0251279B2
JPH0251279B2 JP58240229A JP24022983A JPH0251279B2 JP H0251279 B2 JPH0251279 B2 JP H0251279B2 JP 58240229 A JP58240229 A JP 58240229A JP 24022983 A JP24022983 A JP 24022983A JP H0251279 B2 JPH0251279 B2 JP H0251279B2
Authority
JP
Japan
Prior art keywords
wire
cutter
unit
coated
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58240229A
Other languages
Japanese (ja)
Other versions
JPS60132394A (en
Inventor
Kenji Fukumoto
Eiji Ichitenmanya
Kazuhiro Mori
Kurahei Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58240229A priority Critical patent/JPS60132394A/en
Publication of JPS60132394A publication Critical patent/JPS60132394A/en
Publication of JPH0251279B2 publication Critical patent/JPH0251279B2/ja
Granted legal-status Critical Current

Links

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、異径の被覆線材を電子回路基板へ挿
入配線を行なう多種配線装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multi-wiring device for inserting and wiring coated wires of different diameters into an electronic circuit board.

従来例の構成とその問題点 従来、電子回路基板へ配線する装置では、1種
類の被覆線を供給する供給部と、1種類の線材を
挿入する挿入ヘツドにて配線を行なう装置であり
異径の線材を挿入配線する場合、専用の挿入ヘツ
ドを持ちオペレーターによる交換作業が必要で、
同じ電子回路基板においては2回の挿入工程を同
装置で行なう必要があり、電子回路基板設計で
は、配線順序を考慮した設計に制約され、高密度
配線、電子回路基板の低コスト化対応に欠け、更
には電子回路基板設計及び挿入ヘツドの交換等に
よる工数増が必至であり迅速性に欠ける欠点を有
していた。
Conventional structure and its problems Conventionally, devices for wiring to electronic circuit boards have a supply section that supplies one type of coated wire and an insertion head that inserts one type of wire. When inserting and wiring wires, it is necessary to have a special insertion head and replace the wire by an operator.
For the same electronic circuit board, it is necessary to perform the insertion process twice using the same device, and electronic circuit board design is constrained by consideration of the wiring order, making it difficult to support high-density wiring and cost reduction of electronic circuit boards. Moreover, the number of man-hours required for designing the electronic circuit board and replacing the insertion head is inevitably increased, and this method has the drawback of lacking speed.

発明の目的 本発明は上記従来の欠点を解消し、異径の被覆
線を自由に、電子回路基板へ挿入配線できる多種
配線装置を提供しようとするもである。
OBJECTS OF THE INVENTION The present invention aims to eliminate the above-mentioned conventional drawbacks and provide a multi-wiring device that can freely insert and wire coated wires of different diameters into electronic circuit boards.

発明の構成 本発明の多種配線装置は電子回路基板を保持
し、位置決め可能なX・Y・θテーブルと、被覆
線材を切断、皮覆をストリツプすると同時にL型
に成型可能でかつ一定の間隔で設けられた1対の
カツターユニツトと、複数の異径被覆線材の中か
ら所望の径を有する被覆線材をチヤツクユニツト
にて引き出すとともに前記線材の他端部を固定チ
ヤツクユニツトにてチヤツキングすることにより
前記カツターユニツトに線材を供給する供給装置
と、前記1対のカツターユニツトを2組有し、リ
ード線を前記電子回路基板へ挿入する挿入ヘツド
と、前記基板へ挿入されたリード線をカシメ固定
する1対のクリチユニツトよりなるアンビル部
と、前記線材の種類に応じて前記2組のカツタユ
ニツト所定位置へ移動させる移動手段とを有する
ものである。
Structure of the Invention The multi-wiring device of the present invention has an X/Y/θ table that can hold and position an electronic circuit board, cut a coated wire, strip the sheathing, and simultaneously form it into an L shape, and at regular intervals. A pair of cutter units provided, a chuck unit pulls out a coated wire having a desired diameter from a plurality of coated wires of different diameters, and the other end of the wire is chucked with a fixed chuck unit to cut the cutter. The electronic circuit board has two sets of a supply device for supplying wire rods to the terminal unit and the pair of cutter units, an insertion head for inserting the lead wire into the electronic circuit board, and a caulking fixation of the lead wire inserted into the board. The cutter unit has an anvil portion consisting of a pair of cutter units, and a moving means for moving the two sets of cutter units to predetermined positions depending on the type of the wire rod.

そして、この構成により挿入ヘツドの交換が不
要で、1回の挿入工程で異種の線径の配線が可能
となり、基板設計においても自由な設計ができ迅
速性に富み、基板の低コスト化、高密度配線に対
応できることになる。
This configuration eliminates the need to replace the insertion head, making it possible to wire different wire diameters in a single insertion process, allowing for flexible board design and speed, reducing the cost of the board and increasing the cost. This makes it possible to handle high-density wiring.

実施例の説明 以下本発明の一実施例について、図面を参考に
しながら説明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明の一実施方法による基板1であ
り、第2図は多種配線装置を示すが、本体2上に
は、第1図で示した基板1を保持し位置決めする
X・Y・θテーブル3、線材を受取り挿入する挿
入する挿入ヘツド4、リード線をカシメ固定する
アンビル部5、線材を供給する供給装置6が設け
られた多種配線装置について以下その動作説明を
する。
FIG. 1 shows a board 1 according to one implementation method of the present invention, and FIG. 2 shows a multi-type wiring device. The operation of the multi-wiring device, which is provided with a θ table 3, an insertion head 4 for receiving and inserting a wire, an anvil portion 5 for caulking and fixing a lead wire, and a supply device 6 for supplying the wire, will be described below.

第3図の様に挿入ヘツド4へギヤ8,9を支点
として回転のできる揺動フレーム10が取付けら
れており、揺動フレーム10へは、モーター11
を駆動源として、タイミングプーリー12,13
とタイミングベルト14を介し、ボールネジ15
が回転位置決め可能な様に取付けられている。
As shown in FIG. 3, a swinging frame 10 that can rotate around gears 8 and 9 is attached to the insertion head 4, and a motor 11 is attached to the swinging frame 10.
As a driving source, timing pulleys 12 and 13
and the ball screw 15 via the timing belt 14.
is installed so that it can be rotated and positioned.

前記ボールネジ15には、ガイドレール16を
ガイドとして一定間隔を持つて摺動可能な小径線
材17用カツターユニツト18,19と、大径線
20材用カツターユニツト21,22が取付けて
あり、小径線材17と大径線材20に合わせ、モ
ーター11により一定間隔を持つたまま平行移動
しカツターユニツト18の所へカツターユニツト
21、カツターユニツト19の所へカツターユニ
ツト22が切換可能な構造を作り出している。又
小径線材17と大径線材20は、スライドプレー
ト23上へ固定されたガイド24,25により供
給されており、スライドプレート23は、ガイド
ロツド26,27をガイドとして切換えが可能で
ある。まず小径線材17は、チヤツクユニツト2
8により、チヤツキング状態で一定寸法引出さ
れ、同時に固定チヤツクユニツト29にてチヤツ
キングを行ないテンシヨンを持つた状態にする。
揺動フレーム10は挿入ヘツド7を上昇する事に
より当りブロツク30,31へラツク32,33
が当り、ギヤ8,9を介し回転し、同時に挿入ヘ
ツドに固定されたシヤフト34へカツターユニツ
ト18,19,21,22に取付けられたレバー
35が当り、カム36にガイドされカツター下3
7がカツターユニツト18,19,21,22下
へ押出され、カツター上38,39を下降する事
により、プツシヤー40,41,42,43にて
小径線材17をチヤツキングした状態でカツト・
アンドストリツプ及びL型成形を行ない、小径線
材17を受取る。受取り完了後挿入ヘツド7は下
降し、揺動フレーム10は、ラツク32,33、
ギヤ8,9を介し垂直状態に復帰、更にカツター
下37についてもカム36に従つて復帰する。再
度挿入ヘツド7を基板1上まで下降し、プツシヤ
ー40,41,42,43で基板1内に加工され
ている挿入穴へ、受け取りL型成形をした、リー
ド線を挿入し、基板下に露出したリード線を、ア
ンビル部のクリンチユニツト44,45のクリン
チ爪46,47で折り曲げ挿入完了する。その後
カツターユニツトは、モーター11を駆動源とし
て、ボールネジ15によりカツターユニツト1
8,19とカツターユニツト21,22が切換わ
る。一方小径線材17と大径線材20は、モータ
ー48を駆動源としてボールネジ49を介して切
換わり、小径線材17と同様チヤツクユニツト2
8によりチヤツキング状態で引出しカツターユニ
ツト21,22のカツター上50,51と、カツ
ター下52,53によりプツシヤー54,55,
56,57に大径線材20はチヤツキングホール
ドした状態のまま、切断と皮覆のストリツプ及び
L型成形を行ない基板1内の別の挿入穴へ挿入配
線を完了する。
Attached to the ball screw 15 are cutter units 18 and 19 for the small diameter wire 17 and cutter units 21 and 22 for the large diameter wire 20, which are slidable at a constant interval using the guide rail 16 as a guide. The motor 11 moves the wire parallel to the small diameter wire 17 and the large diameter wire 20 at a constant interval, and the cutter unit 21 can be switched to the cutter unit 18, and the cutter unit 22 can be switched to the cutter unit 19. creating a structure. Further, the small diameter wire 17 and the large diameter wire 20 are supplied by guides 24 and 25 fixed onto a slide plate 23, and the slide plate 23 can be switched using guide rods 26 and 27 as guides. First, the small diameter wire 17 is connected to the chuck unit 2.
8, it is pulled out by a certain distance in the chuck state, and at the same time, the fixed chuck unit 29 performs chuck to bring it into the tensioned state.
By raising the insertion head 7, the swinging frame 10 connects to the hit blocks 30, 31 with the racks 32, 33.
The lever 35 attached to the cutter units 18, 19, 21, 22 hits the shaft 34 fixed to the insertion head, and is guided by the cam 36 and rotates through the gears 8 and 9.
7 is pushed out below the cutter units 18, 19, 21, 22, and lowers the upper cutters 38, 39, thereby cutting the small diameter wire 17 while chucking it at the pushers 40, 41, 42, 43.
After performing and stripping and L-shape forming, the small diameter wire 17 is received. After the receiving is completed, the insertion head 7 is lowered, and the swing frame 10 is moved to the racks 32, 33,
The lower cutter 37 is returned to the vertical state via the gears 8 and 9, and the lower cutter 37 is also returned to the vertical state via the cam 36. Lower the insertion head 7 again to the top of the board 1, insert the L-shaped receiving lead wire into the insertion hole made in the board 1 with pushers 40, 41, 42, and 43, and expose it below the board. The lead wire is bent by the clinch claws 46, 47 of the clinch units 44, 45 of the anvil portion, and the insertion is completed. Thereafter, the cutter unit 1 is moved by the ball screw 15 using the motor 11 as a driving source.
8, 19 and cutter units 21, 22 are switched. On the other hand, the small diameter wire 17 and the large diameter wire 20 are switched via a ball screw 49 using a motor 48 as a driving source, and the chuck unit 2 is connected to the small diameter wire 17 similarly to the small diameter wire 17.
8, the upper cutters 50, 51 of the drawer cutter units 21, 22 are pulled out in the chuck state, and the lower cutters 52, 53 are used to push the pushers 54, 55,
At 56 and 57, the large-diameter wire 20 is held in a chuck-and-hold state and is cut, covered with a strip, and formed into an L-shape to complete the insertion and wiring into another insertion hole in the substrate 1.

発明の効果 以上の様に異径線材用カツターユニツトを持ち
制御的に切換える事により、多種配線が容易に行
なう事ができ、基板設計工数の削減が可能で、高
密度な配線、基板の低コスト化に充分対応でき
る。
Effects of the invention As described above, by having a cutter unit for wires with different diameters and switching them in a controlled manner, it is possible to easily perform various types of wiring, reduce the number of board design steps, and achieve high-density wiring and low board design. Can fully cope with cost reduction.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は配線完了後の電子回路基板の斜視図、
第2図は本発明の一実施例における多種配線装置
全体の斜視図、第3図は本発明の一実施例におけ
る多動配線装置の挿入ヘツド部の斜視図である。 1……電子回路基板、4……挿入ヘツド、18
……小径用第一セクシヨンカツターユニツト、1
9……小径用第二セクシヨンカツターユニツト、
21……大径用第一セクシヨンカツターユニツ
ト、22……大径用第二セクシヨンカツターユニ
ツト、24……小径用供給ガイド、25……大径
用供給ガイド、28……チヤツクユニツト、45
……クリンチユニツト、46……クリンチユニツ
ト。
Figure 1 is a perspective view of the electronic circuit board after wiring is completed.
FIG. 2 is a perspective view of the entire multi-wiring device according to an embodiment of the present invention, and FIG. 3 is a perspective view of an insertion head portion of the multi-variable wiring device according to an embodiment of the present invention. 1...Electronic circuit board, 4...Insertion head, 18
...First section cutter unit for small diameter, 1
9...Second section cutter unit for small diameter,
21... First section cutter unit for large diameter, 22... Second section cutter unit for large diameter, 24... Supply guide for small diameter, 25... Supply guide for large diameter, 28... Chuck unit, 45
...Clinch unit, 46...Clinch unit.

Claims (1)

【特許請求の範囲】[Claims] 1 電子回路基板を保持し、位置決め可能なX・
Y・θテーブルと、被覆線材を切断、皮覆をスト
リツプすると同時にL型に成型可能でかつ一定の
間隔で設けられた1対のカツターユニツトと、複
数の異径被覆線材の中から所望の径を有する被覆
線材をチヤツクユニツトにて引き出すとともに前
記線材の他端部を固定チヤツクユニツトにてチヤ
ツキングすることにより前記カツターユニツトに
線材を供給する供給装置と、前記1対のカツター
ユニツトを2組有し、リード線を前記電子回路基
板へ挿入する挿入ヘツドと、前記基板へ挿入され
たリード線をカシメ固定する1対のクリチユニツ
トよりなるアンビル部と、前記線材の種類に応じ
て前記2組のカツターユニツト所定位置へ移動さ
せる移動手段とを有する多種配線装置。
1.
A Y/θ table, a pair of cutter units that can cut the coated wire, strip the sheathing, and simultaneously form it into an L-shape, and are installed at a constant interval, and cut the coated wire as desired from among a plurality of coated wires with different diameters. a feeding device that supplies the wire to the cutter unit by pulling out a coated wire having a diameter with a chuck unit and chucking the other end of the wire with a fixed chuck unit; and two sets of the pair of cutter units. and an anvil portion consisting of an insertion head for inserting the lead wire into the electronic circuit board, a pair of crimp units for crimping and fixing the lead wire inserted into the board, and the two sets of cutters depending on the type of the wire material. A multi-purpose wiring device having a moving means for moving a terminal unit to a predetermined position.
JP58240229A 1983-12-20 1983-12-20 Various wiring device Granted JPS60132394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58240229A JPS60132394A (en) 1983-12-20 1983-12-20 Various wiring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58240229A JPS60132394A (en) 1983-12-20 1983-12-20 Various wiring device

Publications (2)

Publication Number Publication Date
JPS60132394A JPS60132394A (en) 1985-07-15
JPH0251279B2 true JPH0251279B2 (en) 1990-11-06

Family

ID=17056368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58240229A Granted JPS60132394A (en) 1983-12-20 1983-12-20 Various wiring device

Country Status (1)

Country Link
JP (1) JPS60132394A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693238A (en) * 1992-09-11 1994-04-05 Tomoegawa Paper Co Ltd Bonding sheet

Also Published As

Publication number Publication date
JPS60132394A (en) 1985-07-15

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