JP2810758B2 - Electronic component insertion method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a method of mounting an electronic component of an axial type having a lead wire protruding in the axial direction from a main body on a substrate by bending the lead wire to a predetermined position on the substrate. The present invention relates to an electronic component insertion method for automatically inserting an electronic component into an insertion hole.

2. Description of the Related Art Conventionally, in the above-mentioned automatic insertion device for an axial electronic component, as shown in FIGS. 9 (a) and 9 (b), the tips of the lead wires 3a and 3b protruding from the main body 2 are taped with Many axial electronic components 1 by holding at 4b
Are connected at a predetermined pitch, and the electronic components 1 are sequentially placed at predetermined positions by setting the electronic component assembly 5 in a component supply device 6 as shown in FIG. It is configured to supply. No.
In FIG. 10, reference numeral 7 denotes a wheel that engages with the lead wires 3a and 3b to feed the pitch, and 8 denotes a ratchet wheel that rotates the wheel 7 intermittently. The electronic component 1 supplied to the predetermined position is cut and bent by cutting the lead wires 3a, 3b of the electronic component 1 by an insertion head 10 as shown in FIG. 3, and is inserted into insertion guides 11a, 11b as shown in FIG. The lead wires 3a, 3b are bent and held to guide them to the upper surface of the substrate, and the pusher 12 presses the main body 2 to insert the lead wires 3a, 3b into predetermined insertion holes of the substrate.

At this time, a buffer spring is built in the pusher 12,
There is a type in which the push-in position by the pusher 12 is set based on data input in advance so that excessive stress is not applied to the main body 2 of the electronic component 1.

Also, a mechanism for switching the insertion guides 11a and 11b and the pusher 12 in accordance with the pitch of the insertion holes in the substrate is provided in the insertion head 10, and the lead wires are adjusted in accordance with the pitches of the various types of insertion holes.
Some are designed to bend 3a and 3b.

However, in the above configuration, the diameter of the main body 2 of the electronic component 1 and the lead wires 3a, 3b
There is a problem that a large amount of labor is required, since the diameter of the sample must be measured and input in advance as data.

In addition, it is not possible to absorb variations among components, and as a result, stress is applied to the main body 2 or the lead wires 3a, 3b
However, there is a problem that the cut and bent dimensions may not accurately match the pitch of the insertion holes.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide an electronic component insertion method that can significantly reduce the time required to create input data and that can perform highly reliable insertion.

Means for Solving the Problems In order to achieve the above object, the present invention provides a step of supplying an electronic component having a lead wire protruding from its main body in the axial direction to a predetermined position, and Diameter measuring process, cutting and bending lead wire to predetermined length, and setting based on measurement data of electronic component main body diameter with bent lead wire guided to upper surface of board by insertion guide And pressing the main body with a pusher to the specified height position to insert a lead wire into a predetermined insertion hole of the substrate.

Further, a supplying step of the electronic component, a step of measuring a diameter of a lead wire of the supplied electronic component, and a step of cutting the lead wire to a predetermined length to obtain a dimension set and corrected based on the measurement data of the lead wire diameter. The method includes a step of bending the lead wire and a step of pressing the main body with a pusher to insert the lead wire into a predetermined insertion hole of the substrate.

According to the above configuration of the present invention, since the diameter of the main body or lead wire of the supplied electronic component is measured and the height position of the main body pressed by the pusher or the bending dimension of the lead wire is corrected and inserted, the electronic component is inserted. Even if you do not prepare the input data by measuring the diameter of the component body or the lead wire diameter in advance, there is a risk that excessive stress will be applied to the body or the lead wire will be improperly inserted into the insertion hole of the board. Absent.

Embodiment An embodiment of the present invention will be described below with reference to FIGS.

The electronic component 1 is in the form of a tape-shaped electronic component assembly 5 as shown in FIG. 9 in the same manner as described in the conventional example, and is used in a component supply device 6 as shown in FIG. The electronic components 1 are sequentially supplied to predetermined positions. Tape-like electronic component assembly 5 pitch-fed by the component supply device 6
As shown in FIG. 2, the electronic component 1 is guided by a component supply guide 13 that slidably supports the tapes 4a and 4b.
Measuring means for measuring the diameter of the main body 2 and the diameter of the lead wires 3a, 3b
14a and 14b and the tapes 4a and 4b are fed to tape cutters 15a and 15b for cutting the electronic components 1 for each. The diameter of the main body 2 and the diameter of the lead wires 3a and 3b are measured, and the electronic component 1 separated by the tape cutters 15a and 15b is received by the lever 16 of the insertion head 10 shown in FIGS. The insertion head 10 cuts and bends the lead wires 3a and 3b, and inserts the substrate into the insertion hole.

3 and 4, reference numerals 11a and 11b denote lead wires 3a and 3b.
Guides to bend and guide to the upper surface of the substrate, 12 is a pusher for pressing the main body 2 and inserting the lead wires 3a, 3b guided by the insertion guide 11 into the insertion holes of the substrate, and 17, 18 are the lead wires. A movable blade and a fixed blade for cutting 3a and 3b to a predetermined length.

The pusher 12 is, as shown in FIG.
And a push-in height setting means 21 for controlling the swing end of the swing lever 20 to set the push-in position of the main body 2 by the pusher 12. ing. Note that the swing lever 20
Instead of regulating the swing end of the swing lever 20, the lever length of the swing lever 20 may be adjusted.

Further, as shown in FIG. 6, the insertion guide 11 is mounted on slide blocks 22a and 22b supported so as to be able to approach and separate from each other, and these slide blocks 22a and 22b are
The drive screw 23 is configured to be able to be positioned at an arbitrary rotational position by the rotary drive means 25 through joints 24a and 24b which can be detachably connected to each other while being engaged with the screw portions in the left and right opposite directions formed in I have. Therefore, when the driving screw 23 is rotated by the rotation driving means 25, the insertion guides 11a, 11b
The interval between them can be set arbitrarily.

Next, the lead wires 3a and 3b of the electronic component 1 are inserted into the insertion holes of the board 30.
The operation of inserting the data into the 31a and 31b will be described with reference to the flowchart shown in FIG. Each electronic component 1 of the tape-shaped electronic component assembly 5 as shown in FIG.
The diameter of the main body 2 and the diameter of the lead wires 3a, 3b are measured by the measuring means 14a, 14b shown in FIG. The height position of the push-in height setting means 21 shown in FIG. 5 is set and adjusted based on the measurement result, and the insertion guide 11a, via the slide blocks 22a and 22b, is rotated by the rotation driving means 25 shown in FIG. The interval between 11b is adjusted. That is, as shown in FIGS. 7 (a) and 7 (b), the pushing height position of the pusher 12 is adjusted according to the diameter of the main body 2, and as shown in FIGS. 8 (a) and 8 (b). Into the insertion hole 31 of the substrate 30 according to the diameter of the lead wires 3a, 3b.
a, 31b center pitch P and lead wires 3a, 3b axial center pitch p
The intervals between the insertion guides 11a and 11b are adjusted so that the values match.

After the above adjustments have been made, the lead wires 3a and 3b are cut to a predetermined length by the movable blade 17 and the fixed blade 18 with the electronic component held by the lever 16, and then inserted as shown in FIG. The guides 11a and 11b move toward the substrate 30, and lead wires 3a and 3b
After being bent so as to coincide with the centers of the insertion holes 31a and 31b, as shown in FIG. 7, the pusher 12 moves toward the substrate 30 and the lever 16 retreats to move the lead wires 3a and 3b. It is inserted into the insertion holes 31a and 31b. Thereafter, the tips of the lead wires 3a and 3b are fixed to the substrate 30 by appropriate means. Then, the next electronic component 1 is supplied, and the above operation is repeated.

According to the present invention, the diameter of the main body or lead wire of the supplied electronic component is measured, and the pressing height position of the main body by the pusher and the bending dimension of the lead wire are corrected and inserted. Even if you do not measure the diameter of the main body or the diameter of the lead wire in advance and create input data, there is no risk of applying excessive stress to the main body or improperly inserting the lead wire into the insertion hole of the board. It can greatly improve the reliability of the electronic component insertion process while significantly reducing the data creation time, and can also achieve significant effects such as being able to insert properly even if individual electronic components have dimensional variations. .

[Brief description of the drawings]

FIG. 1 is a flowchart of an operation of inserting an electronic component into a board in one embodiment of the present invention, FIG. 2 is a perspective view of a process of measuring the diameter of a main body and lead wires of the electronic component and separating the electronic components into electronic components, FIG. 3 is a partial cross-sectional view showing a schematic configuration of the insertion head, FIG. 4 is a cross-sectional view of the main part, FIG. 5 is a partial cross-sectional view showing driving means of the pusher, and FIG. 7 (a) and 7 (b) are cross-sectional views showing a pressed state by the pusher, and FIGS. 8 (a) and (b) are states before and after position correction of the insertion guide. 9 (a) and 9 (b) are a plan view and a front view of a tape-shaped electronic component assembly, and FIG. 10 is a perspective view of component supply means. DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Body 3a, 3b ... Lead wire 6 ... Component supply device 11a, 11b ... Insertion guide 12 ... Pusher 13 ... Component supply guide 14a, 14b ... Measuring means 21 ... Push-in Height setting means 22a, 22b ... Slide block.

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Claims (2)

(57) [Claims] A step of supplying an electronic component having a lead wire protruding from the main body in the axial direction to a predetermined position; a step of measuring a diameter of the main body of the supplied electronic component; In the process of cutting and bending into pieces, and bending the lead wire to the top surface of the board with the insertion guide, press the body with a pusher to the height position set based on the measurement data of the body diameter of the electronic component Inserting a lead wire into a predetermined insertion hole of the board. 2. A step of supplying an electronic component having a lead wire projecting in the axial direction from a main body to a predetermined position, a step of measuring a diameter of a lead wire of the supplied electronic component, and a step of lengthening the lead wire by a predetermined length. And bending the lead wire to the dimension corrected based on the lead wire diameter measurement data, and pressing the main body with a pusher while guiding the bent lead wire to the top surface of the board with the insertion guide Inserting a lead wire into a predetermined insertion hole of the board.