JP3271866B2 - Electronic component insertion method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for automatically inserting an electronic component into a predetermined position on a substrate.

[0002]

2. Description of the Related Art The structure of a conventional electronic component insertion device will be described with reference to FIGS. 6 and 7, an electronic component 21 having a lead wire 22 is mounted on a parts cassette 24 for supplying the electronic component 21 with both ends of the lead wire 22 held by a tape 23, The electronic components 21 are configured to be sequentially supplied one by one. Tape 2 is located at the end of the parts cassette 24.
3, a tape cutter 25 having a pair of blades 26a and 26b for separating the electronic components 21 one by one is provided. Reference numeral 27 denotes an insertion means for forming the lead wire 22 of the electronic component 21 into a predetermined shape and then inserting the lead wire 22 into an insertion hole 29a at a predetermined position of the printed board 29.
The electronic component 21 separated at 5 is transferred to the insertion means 27 by the transfer means 28.

The insertion means 27 has a V-shaped groove 31 for holding the lead wire 22 in a direction perpendicular to the axis when the lead wire 22 of the electronic component 21 is formed and inserted into a predetermined shape, and inserts the lead wire 22 at the time of insertion. A pair of pushers 30 to push in the direction
And a pair of forming levers 32 that support the lead wire 22 when forming the lead wire 22 into a predetermined shape.
A pair of cutters 33 for cutting the lead wires 22 to separate the tapes 23 at both ends of the lead wires 22;
And a pair of insertion guides 34 each having a vertical V-shaped groove 35 for guiding the lead wire 22 toward the predetermined insertion hole 29a.

[0004] Next, an electronic component insertion operation with the above configuration will be described. The electronic component 21 is a parts cassette 24
, And the tape 23 portion is held by the chuck 38 of the transfer means 28. Then tape cutter 2
When the blades 26a, 26b of the fifth tape close, the tape 23
Is cut off, and one electronic component 21 is cut off. The transfer means 28 rotates around the rotation axis 39 in the direction shown in FIG. 7, and further rotates about the rotation axis 40 to place the electronic component 21 at a predetermined position of the insertion means 27, that is, FIGS.
As shown in (a), the lead wire 22 is moved so as to be located between the V groove 31 of the pusher 30 and the forming lever 32. Next, as shown in FIG.
Is lowered until it comes into contact with the molding lever 32, and the lead wire 22 of the electronic component 21 is held by the V groove 31 and the molding lever 32. Next, the cutter 33 descends, crosses the fixed blade 33a, cuts the lead wire 22 of the electronic component 21 to a predetermined length, and cuts off the tape 23 portion. Next, as shown in FIG. 9C, the insertion guide 34 is lowered until it comes into contact with the printed circuit board 29, and the leading end of the lead 22 is held between the V groove 31 of the pusher 30 and the forming lever 32. The lead wire 22 is formed in a direction perpendicular to the axis while receiving the side portion in the vertical V groove 35 of the insertion guide 34.

Next, after the molding lever 32 moves to a position where the pusher 30 is prevented from descending, the pusher 30 descends with the lead wire 22 received in the V groove 31 as shown in FIG. The lead wire 22 of the component 21 is inserted into the printed circuit board 29. The transfer means 28 is a cutter 33
Rotates around the rotation axis 40 after cutting the lead wire 22, discards the tape debris after the electronic component 21 is cut off, rotates around the rotation axis 39, and moves to the position of the tape cutter 25. , And the above operation is repeated.

[0006]

However, in the above-described conventional electronic component insertion apparatus, as shown in FIG. 10, the lead wire 22 of the electronic component 21 is bent, and the transfer means 28 is not provided.
When a shift δ occurs between the center of the lead wire 22 held by the chuck 38 and the center of the lead wire 22 held by the V groove 31 of the pusher 30, FIG.
As shown in FIG. 1, even if the transfer means 28 moves to the insertion means 27 side, there is a shift δ between the center line 41 of the V-groove 31 of the pusher 30 and the center line 42 of the lead wire 22, so that the lead wire 22 is not properly received in the V-groove 31, and as a result, the lead wire 22 cannot be formed into a predetermined shape, resulting in a problem that an insertion error occurs.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, the present invention provides a method and an apparatus for inserting an electronic component, which can form a lead wire into a predetermined shape by an insertion means and securely insert it into a substrate even if the lead wire is bent. It is intended to be.

[0008]

According to the electronic component insertion method of the present invention, an electronic component is delivered to an insertion device, and a lead portion of the electronic component is formed at a molding portion of the insertion device and inserted into a predetermined position on a substrate. In the component insertion method, when the electronic component is delivered to the insertion means, a lead wire is brought into contact with a positioning part provided in the insertion means to regulate the position of the molding part and perform molding.

In the electronic component insertion apparatus of the present invention, a transfer unit for transferring an electronic component from a component supply unit to an insertion unit and a lead wire of the electronic component are formed into a predetermined shape by a forming unit, and a predetermined position of a substrate is set. In the electronic component insertion device having an insertion means for inserting the electronic component into the electronic component, a positioning portion for regulating the position of the molded portion by contacting the lead wire of the electronic component transferred by the transfer means is provided in the insertion means. It is characterized by.

[0010] Preferably, the moving stroke of the transfer means when the electronic component is transferred to the insertion means is set so as to move extra beyond the positioning portion. Further, the insertion means includes a cutter for cutting the lead wire before forming the lead wire, and the cutter is provided with a positioning portion.

[0011]

According to the electronic component insertion method of the present invention, when the electronic component is delivered to the insertion device, the lead wire is brought into contact with the positioning portion provided in the insertion device to regulate the position of the molding portion and perform molding. Even if the lead wire is bent, the lead wire can be correctly positioned and formed with respect to the forming portion, and can be reliably formed into a predetermined shape and inserted into the substrate.

Further, according to the electronic component insertion device of the present invention, a positioning portion is provided for controlling the position of the molded portion by bringing the lead wire of the electronic component transferred by the transfer device into contact with the insertion device. Accordingly, the electronic component insertion method can be realized.

Further, if the moving stroke of the transfer means when the electronic component is delivered to the insertion means is excessively moved beyond the positioning part, the lead wire can be reliably positioned by pressing the lead wire against the positioning part. Insertion errors can be reliably prevented.

Further, by providing a positioning portion on a cutter for cutting the lead wire before forming the lead wire, the lead wire can be positioned at the most appropriate position with a simple configuration.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component insertion apparatus according to the present invention will be described below with reference to FIGS.

In FIG. 1 and FIG. 2, an electronic component 1 having a lead wire 2 has a tape 3 at both ends.
The electronic component 1 is mounted on a parts cassette 4 for supplying the electronic components 1 while being held by the electronic component 1, and the electronic components 1 are sequentially supplied one by one. A tape cutter 5 having a pair of blades 6a and 6b for cutting the tape 3 and separating the electronic components 1 one by one is provided at a leading end position of the parts cassette 4.

Reference numeral 7 denotes insertion means for forming the lead wire 2 of the electronic component 1 into a predetermined shape and then inserting the lead wire 2 at a predetermined position on the printed circuit board 9. 1 is transferred by the transfer means 8.

As shown in FIG. 2, the insertion means 7 forms the lead wire 2 of the electronic component 1 into a predetermined shape and inserts the lead wire 2 into the insertion hole 9a formed in the printed circuit board 9.
A pair of pushers 10 having a V-shaped groove 11 for holding the lead wire 2 in the direction perpendicular to the axis and for pushing the lead wire 2 in the insertion direction at the time of insertion.
And a pair of forming levers 12 for supporting the lead wire 2 with the pusher 10 when forming the lead wire 2 into a predetermined shape, and a tape 3 at both ends of the lead wire 2.
A pair of cutters 13 for cutting the lead wire 2 to separate the portion, and a vertical V-groove for forming the lead wire 2 of the electronic component 1 and guiding the lead wire 2 toward a predetermined hole 16 of the printed circuit board 9 And a pair of insertion guides 14 having the same. The pusher 10, the forming lever 12, and the insertion guide 14 form a forming portion of the lead wire 2.

At the lower end of the cutter 13, there is provided a positioning portion 16 for positioning the lead wire 2 of the electronic component 1 transferred by the transfer means 8 in contact therewith. As shown in FIG. 3, the positioning portion 16 is provided at a position shifted from the center line 17 of the insertion means 7 by a half r of the wire diameter of the lead wire 2 beside the blade 13a so as to press the lead wire 2. When the lead wire 2 is pressed against the positioning portion 16, the center of the lead wire 2 exactly matches the center line 17 of the insertion means 7.

The transfer means 8 has a chuck 18 for gripping the tape 3 portion of the electronic component 1, and rotates the electronic component 1 around the rotating shaft cores 19, 20 to thereby hold the electronic component 1 to the chuck 18.
Is transferred from the tape cutter 5 to the insertion means 7 in a state where it is held by the above. Further, when the transfer means 8 rotates around the rotation axis 20 and moves so that the lead wire 2 is located between the V groove 11 of the pusher 10 of the insertion means 7 and the forming lever 12, FIG. As shown in FIG.
It is configured to overstroke by a predetermined amount d (about 0.5 mm) from 7.

Next, the operation of inserting the electronic component 1 having the above configuration will be described. The electronic component 1 is a parts cassette 4
, And the tape 3 is held by the chuck 18 of the transfer means 8. Thereafter, when the blades 6a and 6b of the tape cutter 5 close, the tape 3 is cut and one electronic component 1 is cut off. Next, the transfer means 8 rotates around the rotation axis 19 and faces in the direction shown in FIG. 2, and further rotates about the rotation axis 20 to transfer the electronic component 1 to a predetermined position of the insertion means 7. At this time, since the transfer is performed with a predetermined amount d (about 0.5 mm) overstroke from the center line 17 of the insertion means 7, the lead wire 2 is connected to the cutter 13 as shown in FIGS. Positioning part 16
And the center of the lead wire 2 exactly coincides with the center line 17 of the insertion means 7. As described above, by making the moving amount of the transfer means 18 overstroke by a predetermined amount, the position of the lead wire 2 is regulated by the positioning part 16 even if the lead wire 2 is slightly bent, so that a stable molding operation can be performed. Can be migrated.

Thereafter, a molding / insertion operation is performed.
Since this is the same as the conventional example, the description here is omitted.

In the above embodiment, the electronic component 1 is
Although an axial component in which the lead wires 2 protrude on both sides in the axial direction of the component body has been exemplified, the electronic component to which the present invention is applied is not limited to this, and includes, for example, a jumper wire and the like. It is needless to say that the jumper wire is included in the lead wire 2 in FIG.

[0024]

According to the electronic component insertion method of the present invention, as is apparent from the above description, when the electronic component is delivered to the insertion device, the lead wire is brought into contact with the positioning portion provided on the insertion device to form the electronic component. By controlling the position of the lead and molding it, even if the lead is bent, the lead can be correctly positioned and molded with respect to the molded part, and it can be surely molded into a predetermined shape and inserted into the substrate be able to.

Further, according to the electronic component insertion device of the present invention, a positioning portion is provided for controlling the position of the molded portion by bringing the lead wire of the electronic component transferred by the transfer device into contact with the insertion device. Accordingly, the electronic component insertion method can be realized.

Further, when the moving stroke of the transfer means when the electronic component is delivered to the insertion means is excessively moved beyond the positioning part, the lead wire can be reliably positioned by pressing the lead wire against the positioning part. Insertion errors can be reliably prevented.

Further, by providing the positioning portion on the cutter for cutting the lead wire before forming the lead wire, the lead wire can be positioned at the most appropriate position with a simple configuration.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a component supply unit and a transfer unit of an electronic component insertion device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a transfer unit and an insertion unit of the embodiment.

FIG. 3 is an enlarged side view of the cutter unit in a state where electronic components are transferred in the embodiment.

FIG. 4 is an enlarged side view of a transfer unit in a state where electronic components are transferred in the embodiment.

FIG. 5 is a bottom view of the embodiment with electronic components transferred.

FIG. 6 is a perspective view showing a component supply unit and a transfer unit of a conventional electronic component insertion device.

FIG. 7 is a perspective view showing a transfer means and an insertion means of the conventional example.

FIG. 8 is an enlarged side view of the conventional example in which electronic components are transferred.

FIG. 9 is an explanatory view of the operation of the insertion means in the conventional example.

10A and 10B show a state in which an electronic component with a bent lead wire is transferred in the conventional example, FIG. 10A is a front view, and FIG. 10B is a bottom view.

FIG. 11 is an enlarged side view showing a state in which an electronic component with a bent lead wire has been transferred in the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Lead wire 7 Inserting means 8 Transfer means 9 Printed circuit board 10 Pusher 12 Molding lever 13 Cutter 14 Insertion guide 16 Positioning part

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Kinoshita 1006 Kadoma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-5-198990 (JP, A) 218691 (JP, A) JP-A-60-195999 (JP, A) JP-A-2-148988 (JP, A) JP-A-7-66593 (JP, A) JP-A-4-291799 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (4)

(57) [Claims] An electronic component insertion method for transferring an electronic component to an insertion device, forming a lead wire of the electronic component in a molding portion of the insertion device, and inserting the lead wire into a predetermined position on a substrate. A method of inserting an electronic component, wherein a lead wire is brought into contact with a positioning portion provided in an insertion means to regulate a position with respect to a molding portion and perform molding. 2. An electronic apparatus comprising: transfer means for transferring an electronic component from a component supply unit to an insertion unit; and insertion means for forming a lead wire of the electronic component into a predetermined shape by a forming unit and inserting the lead wire into a predetermined position on a substrate. An electronic component insertion device, wherein a positioning portion for regulating the position of the molded portion by bringing a lead wire of the electronic component transferred by the transfer device into contact with the component is provided in the insertion device. 3. The electronic component insertion device according to claim 2, wherein the moving stroke of the transfer unit when the electronic component is delivered to the insertion unit is set to move extra beyond the positioning unit. 4. The electronic component insertion device according to claim 2, wherein the insertion means includes a cutter for cutting the lead wire before forming the lead wire, and the cutter is provided with a positioning portion.