JPS5923511A - Transfer unit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to radial circuit components used for mounting printed circuit boards, and in particular to a transfer device suitable for automating the molding process of lead portions included in the components. 0 (b) Background of the Technology In recent years, units on which printed circuit board circuits such as terminal devices are mounted have become more densely packed, and as the mounting density increases, automation is required to improve the efficiency of mounting work. progress is being made.

In particular, there is a need for a lead forming process that makes it easy to insert and hold the lead part in printed board mounting of radial components. FIG. 3A is a three-dimensional view showing the radial component, and FIG. In the figure, 1 is a component, 2 is a lead part, 3 is a printed board, and 4
5 indicates an insertion hole, and 5 indicates a pair of tapered pliers.

Conventionally, for example, a printed board in a printed board unit of a control section used in a printer device includes a large number of LSIs.
, radial parts such as capacitors are mounted. As shown in Fig. 1(a), this radial component has a bypass capacitor having a lead portion 2 formed below the component 1, and the lower tip of the lead portion 2 of this bypass capacitor 1 has a rectangular shape. It has become. Then, as a mounting method, as shown in FIG.
1777' Insert the lead part 2 of the board 3 and bend the tip of the lead part 2 with a tapered bench 5 or the like to prevent it from being pulled out from the back side of the printed board 3, and hold it in the insertion hole 4 at the insertion position IA. . Therefore, processing of the ultra-thin lead portion 2 requires a lot of effort, has poor workability, and has disadvantages such as manual mounting, which hinders automatic mounting.

(d) Purpose of the Invention In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide a transfer device that has a simple configuration and can easily and automatically mold the lead portion of a bypass capacitor. .

(e) Structure and object of the invention According to the present invention, there is provided a transfer device that automatically performs lead forming processing on a component having a lead portion, and the first step is to process the component transferred to each process. a means for press-molding the lower end portion of the lead portion;
In the step, a means for aligning the opening pitch of the tip of the pressed lower end of the lead part and cutting the lower tip, and in a third step, a means for forming a curved forming on the cut lead part. This is achieved by providing a transfer device characterized in that it has a configuration comprising:

(f) Examples of the invention An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a diagram for explaining the transfer device according to the present invention, and FIG. 2(a) is a top view showing the structure, and FIG.
b) is a process diagram showing the forming process, and Figure 3 is a diagram showing the forming shape, where (a) is a front view, (b) is a side view, and (0) is a side view of the main part. , (d) are side sectional views showing the mounting state.

In the figure, the same parts as used in Figure 1 are denoted by the same numbers 0, 6 is a fixed base, 7 is a cylinder, and the presser 8 is
Reference numeral 09 is a receptacle which is swingable with respect to the fixed base 6, and 010 attached to the fixed base 6 is a knob type, and 11
12 represents a cutting type, 12 represents a forming type, and 13 represents a forming shape.

In the transfer device of the present invention, as shown in FIG.
, E for inter-process transfer and forming processing 9
is provided on the fixed base 6.

The receiver 9 of the device configured in this way is shown in FIG. 2(b).
As shown in the figure, the parts set from the parts feeding in the first process A,
For coining forming in the next second step B, a hammer mold 10 is provided as a means for determining the length of the lead portion 2 and suppressing the tip, and for forming the tip in the third step C, the pitch P of the lead portion 2 is provided. A cutting die 11 is provided as a means for determining and cutting the tip, and a forming die 12 is provided as a means for straightening the lead portion 2 and shaping the zigzag forming 13 for forming forming in the fourth step. Become.

In the operation of such an apparatus, first, a part 1 is automatically fed from a Zhaag feeder (not shown) and set in a first process A. Next, when holding the wheel (not shown),
When the cylinder 7 moves in the direction of the right arrow and transfers the part 1 to the second process B, a drive source (not shown) moves the tube mold 10
is driven, and the length of the lead portion 2 is determined and the tip coining is performed by the pressing operation in the direction of the arrow.

At 9 o'clock, the holding tool 8 is released from its grip by the drive of the cylinder 7, swung for one process, and returns to its original position, and the next part 1 is set in the first process A. This inter-process swinging of the presser 8 is performed in the same manner in the third process C1 and the fourth process. Then, the part 1 that has completed the second process B is held again by the swinging movement of the presser 8 by the drive of the cylinder 7, and is transferred to the third process C. Then, the cutting die 11 is driven by a drive source (not shown), and the pitch P of the lead portion 2 is determined and the tip is formed by movement in the direction of the arrow. Then, in the fourth step, the part 1 is held and transferred, and the forming die 12 is driven by a drive source (not shown), and the lead part 2 is corrected and the shape of the staggered forming 13 is formed by movement in the direction of the arrow, and the processed EK is transferred. It will be done. At this time, the transfer of each step of the component 1 and the lead forming process are automatically performed by continuous operation.

As shown in Fig. 3, the shape of this lead portion 2 is used to correct the pitch P (Fig. 3 (a)) and to align the position (Fig. 3 (a)).
(b)), and the forming 13 is shaped to prevent removal, and the part 1 is attached to the printed board 3 as shown in FIG. 3(d).
is easily implemented.

In the present invention, the two leads 2 are staggered, but they may be in the same direction.

Therefore, since the lead part 2 of the radial part 1 is processed by this automatic machine, the pitch P and the lead part 2 are corrected and the tip is formed, so that it is easy to insert the lead part 2 into the insertion hole 4 of the printed board 3. , the shape of the lead forming 13 prevents it from coming off the printed board 3. Furthermore, since the dimensional accuracy is high, automatic insertion is easily possible, which improves work efficiency and reduces costs.

(g) Effects of the Invention As described in detail above, the transformer device of the present invention has an easy configuration, has good operability, and has a simple structure for forming the lead portion. Automating the molding process can greatly improve workability by U%.

[Brief explanation of drawings]

FIG. 1 is a necessary diagram for explaining printed board mounting, FIG. 2 is a diagram for explaining a transfer device according to the present invention, and FIG. 3 is a necessary diagram for explaining printed board mounting according to the present invention. . In the figure, 1 is a component, 2 is a lead part, 3 is a printed rod, 4 is an insertion hole, 6 is a fixture, 7 is a cylinder, 8 is a presser, 9 is a receiver, 1o is a tube type, 11 is a cutter Type, 12 is forming type, 13 is forming shape (respectively.

Claims (1)

[Claims] A transfer device that automatically performs lead forming processing on a component having a lead portion, the transfer device comprising means for press-forming a lower end portion of the lead portion in a first step of processing the component transferred to each step. In a second step, a means is provided to align the open pitch of the tip of the pressed lower end of the lead part and to cut the lower tip, and in a third step, a curved forming is formed on the cut lead part. A transfer device characterized in that it has a configuration including means for.