JPS61179558A - 半導体装置の容器 - Google Patents
半導体装置の容器Info
- Publication number
- JPS61179558A JPS61179558A JP60020239A JP2023985A JPS61179558A JP S61179558 A JPS61179558 A JP S61179558A JP 60020239 A JP60020239 A JP 60020239A JP 2023985 A JP2023985 A JP 2023985A JP S61179558 A JPS61179558 A JP S61179558A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- leading
- exposed surface
- semiconductor element
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W76/132—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020239A JPS61179558A (ja) | 1985-02-05 | 1985-02-05 | 半導体装置の容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020239A JPS61179558A (ja) | 1985-02-05 | 1985-02-05 | 半導体装置の容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179558A true JPS61179558A (ja) | 1986-08-12 |
| JPH0334219B2 JPH0334219B2 (OSRAM) | 1991-05-21 |
Family
ID=12021641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60020239A Granted JPS61179558A (ja) | 1985-02-05 | 1985-02-05 | 半導体装置の容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179558A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288379A (ja) * | 2007-05-17 | 2008-11-27 | Toshiba Corp | 半導体パッケージ |
| JP2011049523A (ja) * | 2009-07-28 | 2011-03-10 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
| US10319654B1 (en) * | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
-
1985
- 1985-02-05 JP JP60020239A patent/JPS61179558A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288379A (ja) * | 2007-05-17 | 2008-11-27 | Toshiba Corp | 半導体パッケージ |
| JP2011049523A (ja) * | 2009-07-28 | 2011-03-10 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
| US10319654B1 (en) * | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334219B2 (OSRAM) | 1991-05-21 |
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