JPS6117627B2 - - Google Patents
Info
- Publication number
- JPS6117627B2 JPS6117627B2 JP52124503A JP12450377A JPS6117627B2 JP S6117627 B2 JPS6117627 B2 JP S6117627B2 JP 52124503 A JP52124503 A JP 52124503A JP 12450377 A JP12450377 A JP 12450377A JP S6117627 B2 JPS6117627 B2 JP S6117627B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- wafer holding
- holding plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12450377A JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12450377A JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5458294A JPS5458294A (en) | 1979-05-10 |
JPS6117627B2 true JPS6117627B2 (xx) | 1986-05-08 |
Family
ID=14887093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12450377A Granted JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5458294A (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146667A (en) * | 1980-04-18 | 1981-11-14 | Hitachi Ltd | Mirror surface grinder |
JPS56157036A (en) * | 1980-05-09 | 1981-12-04 | Nec Corp | Simultaneous working of both faces of wafer |
JP2849533B2 (ja) * | 1993-08-18 | 1999-01-20 | 長野電子工業株式会社 | ウェーハの研磨方法 |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
-
1977
- 1977-10-19 JP JP12450377A patent/JPS5458294A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5458294A (en) | 1979-05-10 |
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