JPS61173932A - 金属と樹脂層との積層体の製造法 - Google Patents

金属と樹脂層との積層体の製造法

Info

Publication number
JPS61173932A
JPS61173932A JP60015807A JP1580785A JPS61173932A JP S61173932 A JPS61173932 A JP S61173932A JP 60015807 A JP60015807 A JP 60015807A JP 1580785 A JP1580785 A JP 1580785A JP S61173932 A JPS61173932 A JP S61173932A
Authority
JP
Japan
Prior art keywords
copper
laminate
metal
resin layer
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60015807A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0578414B2 (enExample
Inventor
昭士 中祖
陽一 金子
岡村　寿郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP60015807A priority Critical patent/JPS61173932A/ja
Priority to KR1019850004563A priority patent/KR890004583B1/ko
Priority to EP85304636A priority patent/EP0170414B1/en
Priority to DE8585304636T priority patent/DE3582531D1/de
Priority to US06/750,780 priority patent/US4643793A/en
Publication of JPS61173932A publication Critical patent/JPS61173932A/ja
Publication of JPH0578414B2 publication Critical patent/JPH0578414B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP60015807A 1984-06-29 1985-01-30 金属と樹脂層との積層体の製造法 Granted JPS61173932A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60015807A JPS61173932A (ja) 1985-01-30 1985-01-30 金属と樹脂層との積層体の製造法
KR1019850004563A KR890004583B1 (ko) 1984-06-29 1985-06-26 금속표면 처리공정
EP85304636A EP0170414B1 (en) 1984-06-29 1985-06-28 Process for treating metal surface
DE8585304636T DE3582531D1 (de) 1984-06-29 1985-06-28 Verfahren zur behandlung von metalloberflaechen.
US06/750,780 US4643793A (en) 1984-06-29 1985-07-01 Process for treating metal surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60015807A JPS61173932A (ja) 1985-01-30 1985-01-30 金属と樹脂層との積層体の製造法

Publications (2)

Publication Number Publication Date
JPS61173932A true JPS61173932A (ja) 1986-08-05
JPH0578414B2 JPH0578414B2 (enExample) 1993-10-28

Family

ID=11899115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60015807A Granted JPS61173932A (ja) 1984-06-29 1985-01-30 金属と樹脂層との積層体の製造法

Country Status (1)

Country Link
JP (1) JPS61173932A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021668A (ja) * 1988-03-14 1990-01-05 Sharp Corp データ伝送装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219459A (ja) * 1983-05-27 1984-12-10 Nec Corp 無電解銅メツキ膜の活性保持溶液
JPS6017080A (ja) * 1983-07-08 1985-01-28 Nec Corp 無電解銅めつき液

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219459A (ja) * 1983-05-27 1984-12-10 Nec Corp 無電解銅メツキ膜の活性保持溶液
JPS6017080A (ja) * 1983-07-08 1985-01-28 Nec Corp 無電解銅めつき液

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021668A (ja) * 1988-03-14 1990-01-05 Sharp Corp データ伝送装置

Also Published As

Publication number Publication date
JPH0578414B2 (enExample) 1993-10-28

Similar Documents

Publication Publication Date Title
US4902551A (en) Process for treating copper surface
KR930002220B1 (ko) 구리와 수지와의 접착방법
US4643793A (en) Process for treating metal surface
US4868071A (en) Thermally stable dual metal coated laminate products made from textured polyimide film
US4303798A (en) Heat shock resistant printed circuit board assemblies
JPH0114858B2 (enExample)
KR100495531B1 (ko) 미세 다공성 동피막 및 이를 얻기 위한 무전해 동도금액
JPS63168077A (ja) プリント配線板の製造法
JPS61173932A (ja) 金属と樹脂層との積層体の製造法
JP4370490B2 (ja) ビルドアップ多層プリント配線板及びその製造方法
JPH032354B2 (enExample)
JPH0419306B2 (enExample)
JPS6412215B2 (enExample)
JPH045754B2 (enExample)
JPS623942A (ja) 金属と樹脂層との積層体の製造法
KR20060048413A (ko) 수지 표면 처리제 및 수지 표면 처리법
JPS62270780A (ja) 銅と樹脂との接着方法
JP4366632B2 (ja) 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JPS6235843A (ja) 金属と樹脂層との積層体の製造方法
JPS62169497A (ja) 金属と樹脂層との積層体の製造法
JPS6115981A (ja) 銅の表面処理法
JP2000216536A (ja) 内層回路入り積層板の製造方法
JPS63203773A (ja) 基体への金属被膜の形成方法
JP2001247973A (ja) 洗浄・調整剤及びプリント配線板の無電解銅めっき方法
JPH01124292A (ja) 金属薄層付絶縁基板の製造法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term