JPS61172393A - 電子部品搭載用基板およびその製造方法 - Google Patents

電子部品搭載用基板およびその製造方法

Info

Publication number
JPS61172393A
JPS61172393A JP60013052A JP1305285A JPS61172393A JP S61172393 A JPS61172393 A JP S61172393A JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP S61172393 A JPS61172393 A JP S61172393A
Authority
JP
Japan
Prior art keywords
substrate
recess
metal plate
mounting
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60013052A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0376795B2 (enrdf_load_stackoverflow
Inventor
矢津　一
勝美 馬渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60013052A priority Critical patent/JPS61172393A/ja
Publication of JPS61172393A publication Critical patent/JPS61172393A/ja
Publication of JPH0376795B2 publication Critical patent/JPH0376795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60013052A 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法 Granted JPS61172393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS61172393A true JPS61172393A (ja) 1986-08-04
JPH0376795B2 JPH0376795B2 (enrdf_load_stackoverflow) 1991-12-06

Family

ID=11822356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013052A Granted JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS61172393A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112739A (ja) * 1987-10-27 1989-05-01 Matsushita Electric Works Ltd 電子部品実装用プリント配線板
JPH0379440U (enrdf_load_stackoverflow) * 1989-12-01 1991-08-13
JP2007311510A (ja) * 2006-05-18 2007-11-29 Ngk Spark Plug Co Ltd 配線基板
JP2010258260A (ja) * 2009-04-27 2010-11-11 Nec Corp 放熱プリント基板
JP2014146723A (ja) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd パワー半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946087A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5967687A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946087A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5967687A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112739A (ja) * 1987-10-27 1989-05-01 Matsushita Electric Works Ltd 電子部品実装用プリント配線板
JPH0379440U (enrdf_load_stackoverflow) * 1989-12-01 1991-08-13
JP2007311510A (ja) * 2006-05-18 2007-11-29 Ngk Spark Plug Co Ltd 配線基板
JP2010258260A (ja) * 2009-04-27 2010-11-11 Nec Corp 放熱プリント基板
JP2014146723A (ja) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd パワー半導体装置

Also Published As

Publication number Publication date
JPH0376795B2 (enrdf_load_stackoverflow) 1991-12-06

Similar Documents

Publication Publication Date Title
EP0197148B1 (en) Printed-circuit board for mounting electronic element and method of manufacture thereof
US6002169A (en) Thermally enhanced tape ball grid array package
JPH03152985A (ja) 電子部品搭載用基板
JP2784522B2 (ja) 電子部品搭載用基板及びその製造法
JPH10149901A (ja) 電気抵抗器および電気抵抗器の製造方法
JPH0420279B2 (enrdf_load_stackoverflow)
JPS61172393A (ja) 電子部品搭載用基板およびその製造方法
JPS6134990A (ja) 電子部品搭載用基板およびその製造方法
US6784536B1 (en) Symmetric stack up structure for organic BGA chip carriers
JP2620611B2 (ja) 電子部品搭載用基板
JP2784524B2 (ja) 多層電子部品搭載用基板及びその製造法
JPS61202495A (ja) 電子部品搭載用基板およびその製造方法
JPS6134989A (ja) 電子部品搭載用基板
JPH0263141A (ja) 電子部品搭載用基板の製造方法
JPS61189697A (ja) 電子部品搭載用基板およびその製造方法
JPS6165490A (ja) 電子部品搭載用基板の製造方法
JPH056714Y2 (enrdf_load_stackoverflow)
JPH0823049A (ja) 半導体パッケージ
JPH039341Y2 (enrdf_load_stackoverflow)
JPH04162454A (ja) 混成集積回路装置
JP2700257B2 (ja) 配線基板付きリードフレームとその製造方法
JPS60111489A (ja) 電子部品塔載用基板およびその製造方法
KR19980068016A (ko) 가요성(可撓性) 회로 기판을 이용한 볼 그리드 어레이(Ball Grid Array : BGA) 반도체 패키지 및 그 제조 방법
JPH04124860A (ja) 半導体パッケージ
JPS60187098A (ja) プラグインパツケ−ジ基板

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term