JPS6117138B2 - - Google Patents

Info

Publication number
JPS6117138B2
JPS6117138B2 JP55108539A JP10853980A JPS6117138B2 JP S6117138 B2 JPS6117138 B2 JP S6117138B2 JP 55108539 A JP55108539 A JP 55108539A JP 10853980 A JP10853980 A JP 10853980A JP S6117138 B2 JPS6117138 B2 JP S6117138B2
Authority
JP
Japan
Prior art keywords
electrode
wire
metalized
bridge
collector electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55108539A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5732660A (en
Inventor
Yasuichi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10853980A priority Critical patent/JPS5732660A/ja
Publication of JPS5732660A publication Critical patent/JPS5732660A/ja
Publication of JPS6117138B2 publication Critical patent/JPS6117138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP10853980A 1980-08-04 1980-08-04 Semiconductor device Granted JPS5732660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10853980A JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10853980A JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5732660A JPS5732660A (en) 1982-02-22
JPS6117138B2 true JPS6117138B2 (enrdf_load_stackoverflow) 1986-05-06

Family

ID=14487372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10853980A Granted JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5732660A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP4403199B2 (ja) * 2008-11-17 2010-01-20 株式会社東芝 発光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312271A (en) * 1976-07-20 1978-02-03 Nec Corp Substrate for electronic circuit element

Also Published As

Publication number Publication date
JPS5732660A (en) 1982-02-22

Similar Documents

Publication Publication Date Title
KR970010678B1 (ko) 리드 프레임 및 이를 이용한 반도체 패키지
US5874784A (en) Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor
US5304844A (en) Semiconductor device and method of producing the same
JPH0448767A (ja) 樹脂封止型半導体装置
JP2509027B2 (ja) 半導体装置
JPH06302653A (ja) 半導体装置
JP3031323B2 (ja) 半導体装置とその製造方法
JPS61274333A (ja) 半導体装置
JP2569400B2 (ja) 樹脂封止型半導体装置の製造方法
US4297722A (en) Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island
JPS6117138B2 (enrdf_load_stackoverflow)
JP2798108B2 (ja) 混成集積回路装置
JP2524482B2 (ja) Ｑｆｐ構造半導体装置
JP3297959B2 (ja) 半導体装置
JPH02343A (ja) 電子部品搭載用基板
JPH104167A (ja) 半導体装置
JPH04269841A (ja) 半導体装置
JP2518145B2 (ja) 放熱板付き多層リ―ドフレ―ム
JP2784209B2 (ja) 半導体装置
JP2975783B2 (ja) リードフレームおよび半導体装置
JPH06338539A (ja) 半導体素子の接続方法
JPH03276737A (ja) 半導体装置
JPH0451488Y2 (enrdf_load_stackoverflow)
JPS62169461A (ja) 半導体装置
JPH06140535A (ja) テープキャリアパッケージ型半導体装置