JPS6116702Y2 - - Google Patents

Info

Publication number
JPS6116702Y2
JPS6116702Y2 JP1977087997U JP8799777U JPS6116702Y2 JP S6116702 Y2 JPS6116702 Y2 JP S6116702Y2 JP 1977087997 U JP1977087997 U JP 1977087997U JP 8799777 U JP8799777 U JP 8799777U JP S6116702 Y2 JPS6116702 Y2 JP S6116702Y2
Authority
JP
Japan
Prior art keywords
resin
external
external lead
terminal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977087997U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5414659U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977087997U priority Critical patent/JPS6116702Y2/ja
Publication of JPS5414659U publication Critical patent/JPS5414659U/ja
Application granted granted Critical
Publication of JPS6116702Y2 publication Critical patent/JPS6116702Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1977087997U 1977-07-01 1977-07-01 Expired JPS6116702Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (OSRAM) 1977-07-01 1977-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (OSRAM) 1977-07-01 1977-07-01

Publications (2)

Publication Number Publication Date
JPS5414659U JPS5414659U (OSRAM) 1979-01-30
JPS6116702Y2 true JPS6116702Y2 (OSRAM) 1986-05-22

Family

ID=29014052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977087997U Expired JPS6116702Y2 (OSRAM) 1977-07-01 1977-07-01

Country Status (1)

Country Link
JP (1) JPS6116702Y2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (ja) * 1982-02-12 1983-08-20 新電元工業株式会社 半導体装置
JPS58162642U (ja) * 1982-04-22 1983-10-29 新電元工業株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132177A (en) * 1974-09-11 1976-03-18 Matsushita Electric Industrial Co Ltd Riidoresumoorudotoranjisuta

Also Published As

Publication number Publication date
JPS5414659U (OSRAM) 1979-01-30

Similar Documents

Publication Publication Date Title
US5939779A (en) Bottom lead semiconductor chip stack package
JP2000133767A (ja) 積層化半導体パッケ―ジ及びその製造方法
KR19980055817A (ko) 버텀리드 반도체 패키지 및 그 제조 방법
JP2000329632A (ja) 圧力センサーモジュール及び圧力センサーモジュールの製造方法
JPS63258050A (ja) 半導体装置
JPS6116702Y2 (OSRAM)
JPS6238863B2 (OSRAM)
JP3259377B2 (ja) 半導体装置
JPS63296252A (ja) 樹脂封止型半導体装置
JP2001035961A (ja) 半導体装置及びその製造方法
JPH01196153A (ja) 樹脂封止半導体装置
JP2629853B2 (ja) 半導体装置
JPS5916357A (ja) 半導体装置
JPH0547954A (ja) 樹脂封止型半導体装置
JP3082507U (ja) ダブルサイドチップパッケージ
JPH10303227A (ja) 半導体パッケージ及びその製造方法
JPH07211850A (ja) 半導体装置
KR0167288B1 (ko) 칩크기 반도체 패키지 및 그 제조방법
JPH0378245A (ja) Ｉｃパッケージ
KR0152934B1 (ko) 반도체 패키지
JP2679687B2 (ja) 樹脂封止型半導体装置
JPH05243448A (ja) 集積回路用パッケージ
KR0138302Y1 (ko) 와이어 본딩이 용이한 반도체 장치
JPH02303056A (ja) 半導体集積回路の製造方法
JPH09129803A (ja) ホール素子及びその製造方法