JPS61163653A - 薄型電子機器 - Google Patents
薄型電子機器Info
- Publication number
- JPS61163653A JPS61163653A JP60003673A JP367385A JPS61163653A JP S61163653 A JPS61163653 A JP S61163653A JP 60003673 A JP60003673 A JP 60003673A JP 367385 A JP367385 A JP 367385A JP S61163653 A JPS61163653 A JP S61163653A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- frame
- lead frame
- key
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60003673A JPS61163653A (ja) | 1985-01-11 | 1985-01-11 | 薄型電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60003673A JPS61163653A (ja) | 1985-01-11 | 1985-01-11 | 薄型電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163653A true JPS61163653A (ja) | 1986-07-24 |
| JPH0473624B2 JPH0473624B2 (enrdf_load_stackoverflow) | 1992-11-24 |
Family
ID=11563940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60003673A Granted JPS61163653A (ja) | 1985-01-11 | 1985-01-11 | 薄型電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163653A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742010U (enrdf_load_stackoverflow) * | 1980-08-22 | 1982-03-06 |
-
1985
- 1985-01-11 JP JP60003673A patent/JPS61163653A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742010U (enrdf_load_stackoverflow) * | 1980-08-22 | 1982-03-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0473624B2 (enrdf_load_stackoverflow) | 1992-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4558427A (en) | Sheet-like compact electronic equipment | |
| KR20000010953A (ko) | 반도체장치, 필름 캐리어 테이프 및 이들의 제조방법 | |
| JPS5792852A (en) | Hybrid integrated circuit | |
| GB2135523A (en) | Thin flexible electronic apparatus | |
| JPS61163653A (ja) | 薄型電子機器 | |
| JP2661101B2 (ja) | Icカード | |
| JPS6097696A (ja) | 小型電子機器 | |
| JPH04137583A (ja) | 印刷回路基板 | |
| JPH0319003Y2 (enrdf_load_stackoverflow) | ||
| JPH0721820B2 (ja) | Icカード | |
| JPH01234296A (ja) | Icカード | |
| JP3224257B2 (ja) | 集積回路を搭載したカード | |
| JPS6224262Y2 (enrdf_load_stackoverflow) | ||
| JP2578431Y2 (ja) | 液晶表示装置 | |
| JPS6322697Y2 (enrdf_load_stackoverflow) | ||
| JPH081448U (ja) | 液晶表示装置 | |
| JPH01210393A (ja) | 集積回路装置 | |
| JP2002329806A (ja) | 電気回路部品 | |
| JPS5936826B2 (ja) | 回路基体構造 | |
| JPH01206317A (ja) | 液晶表示素子とプリント基板の接続方法 | |
| JPH0621248Y2 (ja) | ピングリッドアレイパッケージ用回路基板 | |
| JPS5669850A (en) | Method for sealing semiconductor device | |
| JPH081502U (ja) | 液晶表示装置 | |
| JPH05270186A (ja) | Icカード | |
| JPH081446U (ja) | 液晶表示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |