JPS61163601A - 高抵抗用カ−ボンペ−スト - Google Patents

高抵抗用カ−ボンペ−スト

Info

Publication number
JPS61163601A
JPS61163601A JP60004037A JP403785A JPS61163601A JP S61163601 A JPS61163601 A JP S61163601A JP 60004037 A JP60004037 A JP 60004037A JP 403785 A JP403785 A JP 403785A JP S61163601 A JPS61163601 A JP S61163601A
Authority
JP
Japan
Prior art keywords
carbon paste
filler
resistance value
resistance
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60004037A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0577161B2 (enExample
Inventor
正美 石井
優介 戸沢
和夫 宮内
小林　功武
健二 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP60004037A priority Critical patent/JPS61163601A/ja
Publication of JPS61163601A publication Critical patent/JPS61163601A/ja
Publication of JPH0577161B2 publication Critical patent/JPH0577161B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP60004037A 1985-01-16 1985-01-16 高抵抗用カ−ボンペ−スト Granted JPS61163601A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60004037A JPS61163601A (ja) 1985-01-16 1985-01-16 高抵抗用カ−ボンペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60004037A JPS61163601A (ja) 1985-01-16 1985-01-16 高抵抗用カ−ボンペ−スト

Publications (2)

Publication Number Publication Date
JPS61163601A true JPS61163601A (ja) 1986-07-24
JPH0577161B2 JPH0577161B2 (enExample) 1993-10-26

Family

ID=11573760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60004037A Granted JPS61163601A (ja) 1985-01-16 1985-01-16 高抵抗用カ−ボンペ−スト

Country Status (1)

Country Link
JP (1) JPS61163601A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110692A (ja) * 1986-10-28 1988-05-16 日本シイエムケイ株式会社 プリント配線板の製造方法
JPS6452268U (enExample) * 1987-09-26 1989-03-31
JP2006164755A (ja) * 2004-12-07 2006-06-22 Sumitomo Bakelite Co Ltd 抵抗ペーストおよび多層配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681902A (en) * 1979-12-07 1981-07-04 Tdk Electronics Co Ltd Electric resistance material
JPS59181001A (ja) * 1983-03-30 1984-10-15 株式会社村田製作所 カ−ボン抵抗ペ−スト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681902A (en) * 1979-12-07 1981-07-04 Tdk Electronics Co Ltd Electric resistance material
JPS59181001A (ja) * 1983-03-30 1984-10-15 株式会社村田製作所 カ−ボン抵抗ペ−スト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110692A (ja) * 1986-10-28 1988-05-16 日本シイエムケイ株式会社 プリント配線板の製造方法
JPS6452268U (enExample) * 1987-09-26 1989-03-31
JP2006164755A (ja) * 2004-12-07 2006-06-22 Sumitomo Bakelite Co Ltd 抵抗ペーストおよび多層配線板

Also Published As

Publication number Publication date
JPH0577161B2 (enExample) 1993-10-26

Similar Documents

Publication Publication Date Title
US6860000B2 (en) Method to embed thick film components
KR20010070138A (ko) 부동태 부품을 매립하는 개선된 방법
KR101738490B1 (ko) 저온 경화형 감광성 전극 페이스트 및 이를 이용한 전극의 제조방법
JP2965815B2 (ja) 半田付け可能な塗膜形成用導電性ペースト
US6265051B1 (en) Edge connectors for printed circuit boards comprising conductive ink
JPS61163601A (ja) 高抵抗用カ−ボンペ−スト
KR20050073419A (ko) 고분자를 포함하는 첨단재료용 조성물
JP2010090264A (ja) 機能性導電塗料とそれを用いた印刷配線板の製造方法
WO2002059913A1 (en) Chip-type electronic component and chip resistor
JP3798979B2 (ja) 導電ペースト及びその使用
JP4490206B2 (ja) 金属ペースト
JPH0373503A (ja) 回路形成方法
JP3540830B2 (ja) 接着性組成物
JP3047069B2 (ja) 導電塗料および印刷回路基板
JPH0552862B2 (enExample)
JPH0812904A (ja) 電磁波吸収ペーストおよびそのペーストで処理された電子部品
JPH08213203A (ja) チップ抵抗器
JPH07153601A (ja) チップ抵抗器の製造方法
JPS6023460A (ja) 電気抵抗体用塗料
JP2006028213A (ja) 機能性導電塗料並びにそれを用いた電子回路とその形成方法
JP2639468B2 (ja) 抵抗皮膜のレーザートリミング法
WO2024122209A1 (ja) 熱硬化性接着剤、複合フィルム及びプリント配線板
JP2754087B2 (ja) 導電性塗料組成物
JPH0238459A (ja) 有機厚膜抵抗素子に適した組成物
JPS61145214A (ja) 光硬化性感光組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees