JPS61157651A - リ−ドフレ−ム用銅合金 - Google Patents

リ−ドフレ−ム用銅合金

Info

Publication number
JPS61157651A
JPS61157651A JP59279861A JP27986184A JPS61157651A JP S61157651 A JPS61157651 A JP S61157651A JP 59279861 A JP59279861 A JP 59279861A JP 27986184 A JP27986184 A JP 27986184A JP S61157651 A JPS61157651 A JP S61157651A
Authority
JP
Japan
Prior art keywords
lead frame
resin
alloy
adhesion
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59279861A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6330979B2 (enExample
Inventor
Daiji Sakamoto
坂本　大司
Rikizo Watanabe
力蔵 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP59279861A priority Critical patent/JPS61157651A/ja
Priority to US06/707,206 priority patent/US4612167A/en
Publication of JPS61157651A publication Critical patent/JPS61157651A/ja
Publication of JPS6330979B2 publication Critical patent/JPS6330979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP59279861A 1984-03-02 1984-12-28 リ−ドフレ−ム用銅合金 Granted JPS61157651A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59279861A JPS61157651A (ja) 1984-12-28 1984-12-28 リ−ドフレ−ム用銅合金
US06/707,206 US4612167A (en) 1984-03-02 1985-03-01 Copper-base alloys for leadframes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59279861A JPS61157651A (ja) 1984-12-28 1984-12-28 リ−ドフレ−ム用銅合金

Publications (2)

Publication Number Publication Date
JPS61157651A true JPS61157651A (ja) 1986-07-17
JPS6330979B2 JPS6330979B2 (enExample) 1988-06-21

Family

ID=17616963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59279861A Granted JPS61157651A (ja) 1984-03-02 1984-12-28 リ−ドフレ−ム用銅合金

Country Status (1)

Country Link
JP (1) JPS61157651A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005118896A1 (ja) * 2004-06-02 2005-12-15 The Furukawa Electric Co., Ltd. 電気電子機器用銅合金

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS58123862A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金の製造方法
JPS59145746A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS59145749A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS58123862A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金の製造方法
JPS59145746A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS59145749A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005118896A1 (ja) * 2004-06-02 2005-12-15 The Furukawa Electric Co., Ltd. 電気電子機器用銅合金

Also Published As

Publication number Publication date
JPS6330979B2 (enExample) 1988-06-21

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