JPS6115338A - 出入力ピンを誘電体基板に結合する方法 - Google Patents

出入力ピンを誘電体基板に結合する方法

Info

Publication number
JPS6115338A
JPS6115338A JP60030660A JP3066085A JPS6115338A JP S6115338 A JPS6115338 A JP S6115338A JP 60030660 A JP60030660 A JP 60030660A JP 3066085 A JP3066085 A JP 3066085A JP S6115338 A JPS6115338 A JP S6115338A
Authority
JP
Japan
Prior art keywords
pin
pad
brazing material
substrate
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60030660A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582061B2 (https=
Inventor
チヤンドリカ・プラサド
アンドリユー・フランシス・ゼツクジツク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6115338A publication Critical patent/JPS6115338A/ja
Publication of JPH0582061B2 publication Critical patent/JPH0582061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP60030660A 1984-06-29 1985-02-20 出入力ピンを誘電体基板に結合する方法 Granted JPS6115338A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/626,185 US4634041A (en) 1984-06-29 1984-06-29 Process for bonding current carrying elements to a substrate in an electronic system, and structures thereof
US626185 1984-06-29

Publications (2)

Publication Number Publication Date
JPS6115338A true JPS6115338A (ja) 1986-01-23
JPH0582061B2 JPH0582061B2 (https=) 1993-11-17

Family

ID=24509321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60030660A Granted JPS6115338A (ja) 1984-06-29 1985-02-20 出入力ピンを誘電体基板に結合する方法

Country Status (4)

Country Link
US (1) US4634041A (https=)
EP (1) EP0167075B1 (https=)
JP (1) JPS6115338A (https=)
DE (1) DE3580314D1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970570A (en) * 1986-10-28 1990-11-13 International Business Machines Corporation Use of tapered head pin design to improve the stress distribution in the braze joint
US5130768A (en) * 1990-12-07 1992-07-14 Digital Equipment Corporation Compact, high-density packaging apparatus for high performance semiconductor devices
FR2676016B1 (fr) * 1991-04-30 1995-05-12 Commissariat Energie Atomique Procede de brasage de pieces a base de beryllium, a une temperature inferieure a 800degre c.
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
US6430058B1 (en) 1999-12-02 2002-08-06 Intel Corporation Integrated circuit package
US6413849B1 (en) 1999-12-28 2002-07-02 Intel Corporation Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor
JP6060090B2 (ja) * 2011-12-02 2017-01-11 株式会社Uacj アルミニウム合金と銅合金との接合体及びその接合方法
GB201804622D0 (en) * 2018-03-22 2018-05-09 Central Glass Co Ltd Method of producing a vehicle glass assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228263A (en) * 1975-08-28 1977-03-03 Sanken Electric Co Ltd Process of face bonding of flip tip
JPS5941859A (ja) * 1982-09-01 1984-03-08 Tanaka Kikinzoku Kogyo Kk リ−ドピンのろう付方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2606362A (en) * 1947-10-29 1952-08-12 United Aircraft Corp Method of maintaining the desired joint thickness during a soldering operation
FR1368080A (fr) * 1962-09-07 1964-07-24 Westinghouse Brake & Signal Alliage de brasage spécialement utilisable pour la fabrication des dispositifs à conductibilité asymétrique
US3680198A (en) * 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US4182628A (en) * 1978-07-03 1980-01-08 GTE Sylvania Products, Inc. Partially amorphous silver-copper-indium brazing foil
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4488673A (en) * 1982-07-29 1984-12-18 The United States Of America As Represented By The United States Department Of Energy Direct metal brazing to cermet feedthroughs
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228263A (en) * 1975-08-28 1977-03-03 Sanken Electric Co Ltd Process of face bonding of flip tip
JPS5941859A (ja) * 1982-09-01 1984-03-08 Tanaka Kikinzoku Kogyo Kk リ−ドピンのろう付方法

Also Published As

Publication number Publication date
EP0167075A3 (en) 1987-08-05
EP0167075A2 (en) 1986-01-08
EP0167075B1 (en) 1990-10-31
JPH0582061B2 (https=) 1993-11-17
US4634041A (en) 1987-01-06
DE3580314D1 (de) 1990-12-06

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