DE3580314D1 - Verfahren zum schweissen stromfuehrender elemente an ein substrat. - Google Patents

Verfahren zum schweissen stromfuehrender elemente an ein substrat.

Info

Publication number
DE3580314D1
DE3580314D1 DE8585107738T DE3580314T DE3580314D1 DE 3580314 D1 DE3580314 D1 DE 3580314D1 DE 8585107738 T DE8585107738 T DE 8585107738T DE 3580314 T DE3580314 T DE 3580314T DE 3580314 D1 DE3580314 D1 DE 3580314D1
Authority
DE
Germany
Prior art keywords
substrate
electrical elements
welding electrical
welding
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585107738T
Other languages
German (de)
English (en)
Inventor
Chandrika Prasad
Andrew Francis Szewczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3580314D1 publication Critical patent/DE3580314D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
DE8585107738T 1984-06-29 1985-06-24 Verfahren zum schweissen stromfuehrender elemente an ein substrat. Expired - Lifetime DE3580314D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/626,185 US4634041A (en) 1984-06-29 1984-06-29 Process for bonding current carrying elements to a substrate in an electronic system, and structures thereof

Publications (1)

Publication Number Publication Date
DE3580314D1 true DE3580314D1 (de) 1990-12-06

Family

ID=24509321

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585107738T Expired - Lifetime DE3580314D1 (de) 1984-06-29 1985-06-24 Verfahren zum schweissen stromfuehrender elemente an ein substrat.

Country Status (4)

Country Link
US (1) US4634041A (https=)
EP (1) EP0167075B1 (https=)
JP (1) JPS6115338A (https=)
DE (1) DE3580314D1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970570A (en) * 1986-10-28 1990-11-13 International Business Machines Corporation Use of tapered head pin design to improve the stress distribution in the braze joint
US5130768A (en) * 1990-12-07 1992-07-14 Digital Equipment Corporation Compact, high-density packaging apparatus for high performance semiconductor devices
FR2676016B1 (fr) * 1991-04-30 1995-05-12 Commissariat Energie Atomique Procede de brasage de pieces a base de beryllium, a une temperature inferieure a 800degre c.
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
US6430058B1 (en) 1999-12-02 2002-08-06 Intel Corporation Integrated circuit package
US6413849B1 (en) 1999-12-28 2002-07-02 Intel Corporation Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor
JP6060090B2 (ja) * 2011-12-02 2017-01-11 株式会社Uacj アルミニウム合金と銅合金との接合体及びその接合方法
GB201804622D0 (en) * 2018-03-22 2018-05-09 Central Glass Co Ltd Method of producing a vehicle glass assembly

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2606362A (en) * 1947-10-29 1952-08-12 United Aircraft Corp Method of maintaining the desired joint thickness during a soldering operation
FR1368080A (fr) * 1962-09-07 1964-07-24 Westinghouse Brake & Signal Alliage de brasage spécialement utilisable pour la fabrication des dispositifs à conductibilité asymétrique
US3680198A (en) * 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
JPS5953708B2 (ja) * 1975-08-28 1984-12-26 サンケンデンキ カブシキガイシヤ フリツプチツプのフエイスボンデイング法
US4182628A (en) * 1978-07-03 1980-01-08 GTE Sylvania Products, Inc. Partially amorphous silver-copper-indium brazing foil
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4488673A (en) * 1982-07-29 1984-12-18 The United States Of America As Represented By The United States Department Of Energy Direct metal brazing to cermet feedthroughs
JPS5941859A (ja) * 1982-09-01 1984-03-08 Tanaka Kikinzoku Kogyo Kk リ−ドピンのろう付方法
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements

Also Published As

Publication number Publication date
EP0167075A3 (en) 1987-08-05
EP0167075A2 (en) 1986-01-08
EP0167075B1 (en) 1990-10-31
JPS6115338A (ja) 1986-01-23
JPH0582061B2 (https=) 1993-11-17
US4634041A (en) 1987-01-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee