DE3580314D1 - Verfahren zum schweissen stromfuehrender elemente an ein substrat. - Google Patents
Verfahren zum schweissen stromfuehrender elemente an ein substrat.Info
- Publication number
- DE3580314D1 DE3580314D1 DE8585107738T DE3580314T DE3580314D1 DE 3580314 D1 DE3580314 D1 DE 3580314D1 DE 8585107738 T DE8585107738 T DE 8585107738T DE 3580314 T DE3580314 T DE 3580314T DE 3580314 D1 DE3580314 D1 DE 3580314D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- electrical elements
- welding electrical
- welding
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/626,185 US4634041A (en) | 1984-06-29 | 1984-06-29 | Process for bonding current carrying elements to a substrate in an electronic system, and structures thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3580314D1 true DE3580314D1 (de) | 1990-12-06 |
Family
ID=24509321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585107738T Expired - Fee Related DE3580314D1 (de) | 1984-06-29 | 1985-06-24 | Verfahren zum schweissen stromfuehrender elemente an ein substrat. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4634041A (de) |
EP (1) | EP0167075B1 (de) |
JP (1) | JPS6115338A (de) |
DE (1) | DE3580314D1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970570A (en) * | 1986-10-28 | 1990-11-13 | International Business Machines Corporation | Use of tapered head pin design to improve the stress distribution in the braze joint |
US5130768A (en) * | 1990-12-07 | 1992-07-14 | Digital Equipment Corporation | Compact, high-density packaging apparatus for high performance semiconductor devices |
FR2676016B1 (fr) * | 1991-04-30 | 1995-05-12 | Commissariat Energie Atomique | Procede de brasage de pieces a base de beryllium, a une temperature inferieure a 800degre c. |
JP4077888B2 (ja) * | 1995-07-21 | 2008-04-23 | 株式会社東芝 | セラミックス回路基板 |
US6430058B1 (en) | 1999-12-02 | 2002-08-06 | Intel Corporation | Integrated circuit package |
US6413849B1 (en) * | 1999-12-28 | 2002-07-02 | Intel Corporation | Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor |
US20140308541A1 (en) * | 2011-12-02 | 2014-10-16 | Uacj Corporation | Bonded body of aluminum alloy and copper alloy, and bonding method for same |
GB201804622D0 (en) * | 2018-03-22 | 2018-05-09 | Central Glass Co Ltd | Method of producing a vehicle glass assembly |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2606362A (en) * | 1947-10-29 | 1952-08-12 | United Aircraft Corp | Method of maintaining the desired joint thickness during a soldering operation |
FR1368080A (fr) * | 1962-09-07 | 1964-07-24 | Westinghouse Brake & Signal | Alliage de brasage spécialement utilisable pour la fabrication des dispositifs à conductibilité asymétrique |
US3680198A (en) * | 1970-10-07 | 1972-08-01 | Fairchild Camera Instr Co | Assembly method for attaching semiconductor devices |
JPS5953708B2 (ja) * | 1975-08-28 | 1984-12-26 | サンケンデンキ カブシキガイシヤ | フリツプチツプのフエイスボンデイング法 |
US4182628A (en) * | 1978-07-03 | 1980-01-08 | GTE Sylvania Products, Inc. | Partially amorphous silver-copper-indium brazing foil |
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
US4418857A (en) * | 1980-12-31 | 1983-12-06 | International Business Machines Corp. | High melting point process for Au:Sn:80:20 brazing alloy for chip carriers |
US4488673A (en) * | 1982-07-29 | 1984-12-18 | The United States Of America As Represented By The United States Department Of Energy | Direct metal brazing to cermet feedthroughs |
JPS5941859A (ja) * | 1982-09-01 | 1984-03-08 | Tanaka Kikinzoku Kogyo Kk | リ−ドピンのろう付方法 |
US4518112A (en) * | 1982-12-30 | 1985-05-21 | International Business Machines Corporation | Process for controlled braze joining of electronic packaging elements |
-
1984
- 1984-06-29 US US06/626,185 patent/US4634041A/en not_active Expired - Fee Related
-
1985
- 1985-02-20 JP JP60030660A patent/JPS6115338A/ja active Granted
- 1985-06-24 DE DE8585107738T patent/DE3580314D1/de not_active Expired - Fee Related
- 1985-06-24 EP EP85107738A patent/EP0167075B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4634041A (en) | 1987-01-06 |
JPH0582061B2 (de) | 1993-11-17 |
EP0167075B1 (de) | 1990-10-31 |
EP0167075A3 (en) | 1987-08-05 |
EP0167075A2 (de) | 1986-01-08 |
JPS6115338A (ja) | 1986-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |