JPS6115336A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS6115336A
JPS6115336A JP59135946A JP13594684A JPS6115336A JP S6115336 A JPS6115336 A JP S6115336A JP 59135946 A JP59135946 A JP 59135946A JP 13594684 A JP13594684 A JP 13594684A JP S6115336 A JPS6115336 A JP S6115336A
Authority
JP
Japan
Prior art keywords
bonding
wire
capillary
bonded
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59135946A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570935B2 (enExample
Inventor
Koichiro Atsumi
幸一郎 渥美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59135946A priority Critical patent/JPS6115336A/ja
Publication of JPS6115336A publication Critical patent/JPS6115336A/ja
Publication of JPH0570935B2 publication Critical patent/JPH0570935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding

Landscapes

  • Wire Bonding (AREA)
JP59135946A 1984-06-30 1984-06-30 ワイヤボンデイング方法 Granted JPS6115336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59135946A JPS6115336A (ja) 1984-06-30 1984-06-30 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59135946A JPS6115336A (ja) 1984-06-30 1984-06-30 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6115336A true JPS6115336A (ja) 1986-01-23
JPH0570935B2 JPH0570935B2 (enExample) 1993-10-06

Family

ID=15163536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59135946A Granted JPS6115336A (ja) 1984-06-30 1984-06-30 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6115336A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161004A (ja) * 1986-08-18 1990-06-20 Minoru Ihara 堤防の決壊を防止する用具
JPH03125962U (enExample) * 1990-03-31 1991-12-19

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161004A (ja) * 1986-08-18 1990-06-20 Minoru Ihara 堤防の決壊を防止する用具
JPH03125962U (enExample) * 1990-03-31 1991-12-19

Also Published As

Publication number Publication date
JPH0570935B2 (enExample) 1993-10-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term