JPS61141779A - 熱安定性接着剤 - Google Patents

熱安定性接着剤

Info

Publication number
JPS61141779A
JPS61141779A JP60227948A JP22794885A JPS61141779A JP S61141779 A JPS61141779 A JP S61141779A JP 60227948 A JP60227948 A JP 60227948A JP 22794885 A JP22794885 A JP 22794885A JP S61141779 A JPS61141779 A JP S61141779A
Authority
JP
Japan
Prior art keywords
composition
composition according
epoxy resin
catalyst
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60227948A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329266B2 (enExample
Inventor
ジヨセフ　アントニー　オーリチオ
ジヤガデイツシユ　チヤンドラ　ゴスワミ
ジヨセフ　ロバート　ズインガロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stauffer Chemical Co
Original Assignee
Stauffer Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stauffer Chemical Co filed Critical Stauffer Chemical Co
Publication of JPS61141779A publication Critical patent/JPS61141779A/ja
Publication of JPH0329266B2 publication Critical patent/JPH0329266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP60227948A 1984-10-15 1985-10-15 熱安定性接着剤 Granted JPS61141779A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/660,593 US4604230A (en) 1984-10-15 1984-10-15 Thermally stable adhesive
US660593 1984-10-15
US774431 1985-09-12

Publications (2)

Publication Number Publication Date
JPS61141779A true JPS61141779A (ja) 1986-06-28
JPH0329266B2 JPH0329266B2 (enExample) 1991-04-23

Family

ID=24650160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60227948A Granted JPS61141779A (ja) 1984-10-15 1985-10-15 熱安定性接着剤

Country Status (2)

Country Link
US (1) US4604230A (enExample)
JP (1) JPS61141779A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04222889A (ja) * 1990-12-25 1992-08-12 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JPH0817269B2 (ja) * 1988-05-11 1996-02-21 株式会社ソフィアシステムズ 回路ライター
JP2003253125A (ja) * 2001-01-31 2003-09-10 Sumitomo Bakelite Co Ltd 絶縁樹脂組成物及び絶縁樹脂シート並びにプリント配線板
JP2007161880A (ja) * 2005-12-14 2007-06-28 Asahi Kasei Corp ポリアミド酸ワニス組成物及び金属ポリイミド複合体
WO2016088540A1 (ja) * 2014-12-05 2016-06-09 三井金属鉱業株式会社 導電性組成物並びに配線基板及びその製造方法
JP2016138050A (ja) * 2015-01-26 2016-08-04 シーシーアイ株式会社 新規ｇｅｍ−ジヒドロペルオキシド化合物
WO2020085372A1 (ja) * 2018-10-24 2020-04-30 住友ベークライト株式会社 導電性樹脂組成物および半導体装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4808676A (en) * 1986-10-11 1989-02-28 Nippon Telegraph And Telephone Corporation Polyetherimide/epoxyimide resin composition
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
US5037689A (en) * 1989-02-17 1991-08-06 Basf Aktiengesellschaft Toughened thermosetting structural materials
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5159034A (en) * 1989-09-01 1992-10-27 Isp Investments Inc. Polymerization process using tertiary-amylperoxy pivalate as the free radical initiator
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
KR100333452B1 (ko) * 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
US7012320B2 (en) * 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (enExample) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US6337037B1 (en) * 1999-12-09 2002-01-08 Methode Electronics Inc. Printed wiring board conductive via hole filler having metal oxide reducing capability
US6426552B1 (en) * 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
US6294259B1 (en) 2000-07-06 2001-09-25 3M Innovative Properties Company Polyimide hybrid adhesives
KR20030077915A (ko) * 2002-03-27 2003-10-04 김상양 에폭시 다기능 프라이머 접착제
US8686065B2 (en) * 2007-02-28 2014-04-01 Tokuyama Dental Corporation Adhesive agent for adhesion between alginate impression material and impression tray for dental applications, and kit comprising the adhesive agent
WO2010016305A1 (ja) * 2008-08-04 2010-02-11 日立化成工業株式会社 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
JP5642147B2 (ja) * 2012-12-27 2014-12-17 学校法人 関西大学 熱伝導性導電性接着剤組成物
DE102013005486B4 (de) 2013-04-02 2019-02-14 Heraeus Deutschland GmbH & Co. KG Schichtstruktur mit leitfähigem Polymer zur Manipulationserkennung sowie Verfahren zu deren Herstellung
CN110709487B (zh) * 2017-06-07 2022-01-14 田中贵金属工业株式会社 导热性导电性粘接剂组合物
WO2020005941A1 (en) * 2018-06-25 2020-01-02 University Of Florida Research Foundation, Inc. Improving the mechanical integrity of polysulfonic acids
CN116396708B (zh) * 2023-06-08 2023-08-25 清华大学 一种高粘缓固型环氧胶泥组合物及其制备方法和应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2864774A (en) * 1953-04-29 1958-12-16 Sprague Electric Co Process of producing electrically conductive plastic
US3073784A (en) * 1959-07-02 1963-01-15 Du Pont Electrically conductive polymeric compositions
GB1258241A (enExample) * 1967-12-22 1971-12-22
GB1256531A (enExample) * 1968-01-19 1971-12-08
US3684533A (en) * 1970-05-28 1972-08-15 Du Pont Screen printable solder compositions
US3746662A (en) * 1971-08-09 1973-07-17 Du Pont Conductive systems
US4181643A (en) * 1975-04-28 1980-01-01 Ciba-Geigy Corporation Process for the manufacture of crystalline, crosslinked epoxide resins
US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
US4312793A (en) * 1978-03-03 1982-01-26 Charneski Mitchell D Electrical joint compound
US4210704A (en) * 1978-08-04 1980-07-01 Bell Telephone Laboratories, Incorporated Electrical devices employing a conductive epoxy resin formulation as a bonding medium
US4311615A (en) * 1980-03-28 1982-01-19 Nasa Electrically conductive palladium containing polyimide films
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4436785A (en) * 1982-03-08 1984-03-13 Johnson Matthey Inc. Silver-filled glass
US4519941A (en) * 1983-08-09 1985-05-28 National Starch And Chemical Corporation Metal-filled polyimide/polyepoxide blends of improved electrical conductivity

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817269B2 (ja) * 1988-05-11 1996-02-21 株式会社ソフィアシステムズ 回路ライター
JPH04222889A (ja) * 1990-12-25 1992-08-12 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JP2003253125A (ja) * 2001-01-31 2003-09-10 Sumitomo Bakelite Co Ltd 絶縁樹脂組成物及び絶縁樹脂シート並びにプリント配線板
JP2007161880A (ja) * 2005-12-14 2007-06-28 Asahi Kasei Corp ポリアミド酸ワニス組成物及び金属ポリイミド複合体
WO2016088540A1 (ja) * 2014-12-05 2016-06-09 三井金属鉱業株式会社 導電性組成物並びに配線基板及びその製造方法
JPWO2016088540A1 (ja) * 2014-12-05 2017-09-14 三井金属鉱業株式会社 導電性組成物並びに配線基板及びその製造方法
JP2016138050A (ja) * 2015-01-26 2016-08-04 シーシーアイ株式会社 新規ｇｅｍ−ジヒドロペルオキシド化合物
WO2020085372A1 (ja) * 2018-10-24 2020-04-30 住友ベークライト株式会社 導電性樹脂組成物および半導体装置
TWI824045B (zh) * 2018-10-24 2023-12-01 日商住友電木股份有限公司 導電性樹脂組成物及半導體裝置

Also Published As

Publication number Publication date
US4604230A (en) 1986-08-05
JPH0329266B2 (enExample) 1991-04-23

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