JPS61141773U - - Google Patents
Info
- Publication number
- JPS61141773U JPS61141773U JP2478385U JP2478385U JPS61141773U JP S61141773 U JPS61141773 U JP S61141773U JP 2478385 U JP2478385 U JP 2478385U JP 2478385 U JP2478385 U JP 2478385U JP S61141773 U JPS61141773 U JP S61141773U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- cut
- raised portion
- twisted
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図及び第２図は本考案を示し、第１図は断
面図、第２図は要部拡大斜視図、第３図は従来例
の断面図である。
１……枠体、２，３……プリント基板、１５…
…アース用導電箔、１７……アース板、１７ａ，
１７ｃ……切起し部、１７ｂ，１７ｄ……ひねり
部。
1 and 2 show the present invention, FIG. 1 is a sectional view, FIG. 2 is an enlarged perspective view of the main part, and FIG. 3 is a sectional view of a conventional example. 1... Frame body, 2, 3... Printed circuit board, 15...
... Conductive foil for grounding, 17... Earthing plate, 17a,
17c... cut and raised portion, 17b, 17d... twisted portion.
Claims (1)
ント基板を重ね合せ、前記プリント基板の少くと
も一方に、前記切起し部に対応して孔とその周囲
には導電箔を設けて、前記切起し部を前記孔を貫
通して前記プリント基板上に突出せしめてひねり
、該ひねり部先端を枠体の近傍に配置し、前記ひ
ねり部と枠体とプリント基板の導電箔を一体に半
田付けしたことを特徴とする電子機器のアース構
造。 Two printed circuit boards are placed one on top of the other with a ground plate provided with a cut-and-raised portion sandwiched therebetween, and conductive foil is provided in at least one of the printed circuit boards in a hole corresponding to the cut-and-raised portion and around the hole. , the cut and raised portion is made to protrude through the hole and onto the printed circuit board and twisted, the tip of the twisted portion is placed near the frame, and the twisted portion, the frame, and the conductive foil of the printed circuit board are integrated. A grounding structure for electronic equipment characterized by soldering to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2478385U JPH048617Y2 (en) | 1985-02-25 | 1985-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2478385U JPH048617Y2 (en) | 1985-02-25 | 1985-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61141773U true JPS61141773U (en) | 1986-09-02 |
| JPH048617Y2 JPH048617Y2 (en) | 1992-03-04 |
Family
ID=30519261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2478385U Expired JPH048617Y2 (en) | 1985-02-25 | 1985-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048617Y2 (en) |
-
1985
- 1985-02-25 JP JP2478385U patent/JPH048617Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048617Y2 (en) | 1992-03-04 |
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