JPS6369474U - - Google Patents
Info
- Publication number
- JPS6369474U JPS6369474U JP1986162282U JP16228286U JPS6369474U JP S6369474 U JPS6369474 U JP S6369474U JP 1986162282 U JP1986162282 U JP 1986162282U JP 16228286 U JP16228286 U JP 16228286U JP S6369474 U JPS6369474 U JP S6369474U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- fastener
- conductive thin
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は導電性薄板をとりだして示す斜視図、第３
図、第４図は従来の印刷基板アース構造を示す斜
視図である。
１１……印刷基板、１２……絶縁基板、１３…
…締付け具、１４……シヤーシ、１５……スペー
サ、２０……導電性薄板。
Figure 1 is a perspective view showing one embodiment of this invention, Figure 2 is a perspective view showing a conductive thin plate taken out, and Figure 3 is a perspective view showing an example of this invention.
FIG. 4 is a perspective view showing a conventional printed circuit board grounding structure. 11...Printed board, 12...Insulating board, 13...
...Tightening tool, 14... Chassis, 15... Spacer, 20... Conductive thin plate.
Claims (1)
者を締付け具により固定する構造において、 前記絶縁基板を両面側から１つの導電性薄板で
挾みこの導電性薄板を前記印刷基板の導電パター
ンに接触させ、さらに前記導電性薄板に前記締付
け具が貫通する穴を設け、前記締付け具の頭部が
前記導電性薄板を介して前記印刷基板の導電パタ
ーンに電気接続される構成としたことを特徴とす
る印刷基板のアース構造。[Claims for Utility Model Registration] In a structure in which a printed circuit board and an insulating board are placed one on top of the other and are fixed by a fastener, the insulating board is sandwiched between two conductive thin plates from both sides. is brought into contact with the conductive pattern of the printed circuit board, and further a hole is provided in the conductive thin plate through which the fastener passes, and the head of the fastener is electrically connected to the conductive pattern of the printed circuit board through the conductive thin plate. A grounding structure for a printed circuit board characterized by having a configuration in which:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986162282U JPS6369474U (en) | 1986-10-24 | 1986-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986162282U JPS6369474U (en) | 1986-10-24 | 1986-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6369474U true JPS6369474U (en) | 1988-05-10 |
Family
ID=31089397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986162282U Pending JPS6369474U (en) | 1986-10-24 | 1986-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6369474U (en) |
-
1986
- 1986-10-24 JP JP1986162282U patent/JPS6369474U/ja active Pending
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