JPS61136556U - - Google Patents

Info

Publication number
JPS61136556U
JPS61136556U JP1957885U JP1957885U JPS61136556U JP S61136556 U JPS61136556 U JP S61136556U JP 1957885 U JP1957885 U JP 1957885U JP 1957885 U JP1957885 U JP 1957885U JP S61136556 U JPS61136556 U JP S61136556U
Authority
JP
Japan
Prior art keywords
film
pads
integrated circuit
semiconductor integrated
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1957885U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1957885U priority Critical patent/JPS61136556U/ja
Publication of JPS61136556U publication Critical patent/JPS61136556U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1957885U 1985-02-13 1985-02-13 Pending JPS61136556U (US07709020-20100504-C00041.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1957885U JPS61136556U (US07709020-20100504-C00041.png) 1985-02-13 1985-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1957885U JPS61136556U (US07709020-20100504-C00041.png) 1985-02-13 1985-02-13

Publications (1)

Publication Number Publication Date
JPS61136556U true JPS61136556U (US07709020-20100504-C00041.png) 1986-08-25

Family

ID=30509280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1957885U Pending JPS61136556U (US07709020-20100504-C00041.png) 1985-02-13 1985-02-13

Country Status (1)

Country Link
JP (1) JPS61136556U (US07709020-20100504-C00041.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283572A (ja) * 1996-04-17 1997-10-31 Nec Corp フィルム・キャリア半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283572A (ja) * 1996-04-17 1997-10-31 Nec Corp フィルム・キャリア半導体装置

Similar Documents

Publication Publication Date Title
JPS6413129U (US07709020-20100504-C00041.png)
JPS61136556U (US07709020-20100504-C00041.png)
JPS593549U (ja) 半導体装置
JPS6120051U (ja) 半導体装置の外囲器
JPS63131137U (US07709020-20100504-C00041.png)
JPS6059561U (ja) 半導体装置
JPH0227746U (US07709020-20100504-C00041.png)
JPS5954952U (ja) 半導体装置
JPS6120079U (ja) 半導体装置実装用基板
JPS6232550U (US07709020-20100504-C00041.png)
JPH0176062U (US07709020-20100504-C00041.png)
JPS6054331U (ja) 半導体装置の実装基板
JPH01125543U (US07709020-20100504-C00041.png)
JPH01157433U (US07709020-20100504-C00041.png)
JPS6117737U (ja) 半導体装置
JPS6127337U (ja) 半導体装置用ヘツダ
JPS60118242U (ja) Icチツプ用パツケ−ジ
JPS617032U (ja) 半導体装置
JPS6046024U (ja) 光電式エンコ−ダ用受光素子
JPS6161833U (US07709020-20100504-C00041.png)
JPH042030U (US07709020-20100504-C00041.png)
JPH0281055U (US07709020-20100504-C00041.png)
JPS58122459U (ja) 半導体素子外囲器
JPS6094836U (ja) 半導体装置
JPS6226065U (US07709020-20100504-C00041.png)