JPS61130485A - 真空モニタ装置 - Google Patents

真空モニタ装置

Info

Publication number
JPS61130485A
JPS61130485A JP25106284A JP25106284A JPS61130485A JP S61130485 A JPS61130485 A JP S61130485A JP 25106284 A JP25106284 A JP 25106284A JP 25106284 A JP25106284 A JP 25106284A JP S61130485 A JPS61130485 A JP S61130485A
Authority
JP
Japan
Prior art keywords
vacuum
chamber
pressure
residual gas
quadrupole mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25106284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0218384B2 (enrdf_load_stackoverflow
Inventor
Shigeru Harada
繁 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25106284A priority Critical patent/JPS61130485A/ja
Publication of JPS61130485A publication Critical patent/JPS61130485A/ja
Publication of JPH0218384B2 publication Critical patent/JPH0218384B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP25106284A 1984-11-28 1984-11-28 真空モニタ装置 Granted JPS61130485A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25106284A JPS61130485A (ja) 1984-11-28 1984-11-28 真空モニタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25106284A JPS61130485A (ja) 1984-11-28 1984-11-28 真空モニタ装置

Publications (2)

Publication Number Publication Date
JPS61130485A true JPS61130485A (ja) 1986-06-18
JPH0218384B2 JPH0218384B2 (enrdf_load_stackoverflow) 1990-04-25

Family

ID=17217056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25106284A Granted JPS61130485A (ja) 1984-11-28 1984-11-28 真空モニタ装置

Country Status (1)

Country Link
JP (1) JPS61130485A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280268A (ja) * 1985-10-04 1987-04-13 Hitachi Ltd 微細加工用真空装置
US5093571A (en) * 1989-07-03 1992-03-03 Fujitsu Limited Method and device for analyzing gas in process chamber
JPH04225219A (ja) * 1990-12-26 1992-08-14 Semiconductor Energy Lab Co Ltd 半導体膜作製方法
WO2006126434A1 (ja) * 2005-05-23 2006-11-30 Ulvac, Inc. 質量分析装置およびその使用方法
FR2888587A1 (fr) * 2005-07-13 2007-01-19 Sidel Sas Appareil pour le depot pecvd d'une couche barriere interne sur un recipient, comprenant un dispositif d'analyse optique du plasma
JP2007095825A (ja) * 2005-09-27 2007-04-12 Mitsubishi Heavy Ind Ltd 真空処理装置及びその不純物監視方法
JP2008157727A (ja) * 2006-12-22 2008-07-10 Ulvac Japan Ltd 質量分析ユニット、及び質量分析ユニットの使用方法
JP2011040559A (ja) * 2009-08-11 2011-02-24 Ulvac Japan Ltd プロセスモニタ装置及び成膜装置、並びにプロセスモニタ方法
CN102612641A (zh) * 2009-11-09 2012-07-25 布鲁克机械公司 真空质量测量系统
CN114813447A (zh) * 2022-07-01 2022-07-29 沈阳天科合达半导体设备有限公司 一种高压气体真空分压测量装置及测量方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57161063A (en) * 1981-03-31 1982-10-04 Nippon Sheet Glass Co Ltd Method and device for sticking metallic oxide film on substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57161063A (en) * 1981-03-31 1982-10-04 Nippon Sheet Glass Co Ltd Method and device for sticking metallic oxide film on substrate

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280268A (ja) * 1985-10-04 1987-04-13 Hitachi Ltd 微細加工用真空装置
US5093571A (en) * 1989-07-03 1992-03-03 Fujitsu Limited Method and device for analyzing gas in process chamber
JPH04225219A (ja) * 1990-12-26 1992-08-14 Semiconductor Energy Lab Co Ltd 半導体膜作製方法
WO2006126434A1 (ja) * 2005-05-23 2006-11-30 Ulvac, Inc. 質量分析装置およびその使用方法
US8826853B2 (en) 2005-07-13 2014-09-09 Sidel Participations Apparatus for PECVD deposition of an internal barrier layer on a receptacle, the apparatus including an optical plasma analysis device
FR2888587A1 (fr) * 2005-07-13 2007-01-19 Sidel Sas Appareil pour le depot pecvd d'une couche barriere interne sur un recipient, comprenant un dispositif d'analyse optique du plasma
WO2007006977A3 (fr) * 2005-07-13 2007-03-22 Sidel Participations Appareil pour le depot pecvd d'une couche barriere interne sur un recipient, comprenant un dispositif d'analyse optique du plasma
JP2007095825A (ja) * 2005-09-27 2007-04-12 Mitsubishi Heavy Ind Ltd 真空処理装置及びその不純物監視方法
JP2008157727A (ja) * 2006-12-22 2008-07-10 Ulvac Japan Ltd 質量分析ユニット、及び質量分析ユニットの使用方法
JP2011040559A (ja) * 2009-08-11 2011-02-24 Ulvac Japan Ltd プロセスモニタ装置及び成膜装置、並びにプロセスモニタ方法
CN102612641A (zh) * 2009-11-09 2012-07-25 布鲁克机械公司 真空质量测量系统
US9322738B2 (en) 2009-11-09 2016-04-26 Mks Instruments, Inc. Vacuum quality measurement system
CN114813447A (zh) * 2022-07-01 2022-07-29 沈阳天科合达半导体设备有限公司 一种高压气体真空分压测量装置及测量方法

Also Published As

Publication number Publication date
JPH0218384B2 (enrdf_load_stackoverflow) 1990-04-25

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